Michael Liehr, Executive Vice President of Innovation and Technology at the State University of New York (SUNY) Polytechnic Institute, will give a talk at 10 a.m. Friday, Jan. 30, in Room 1065 of Kemper Hall on the UC Davis campus. The event is hosted by S.J. Ben Yoo, a professor in the UC Davis Department of Electrical and Computer Engineering. The talk is presented as part of the College of Engineering’s Distinguished Lecture Series.
Scientists from ICFO, MIT, CNRS, CNISM and Graphenea have conducted a study on active electrical control of energy flow from erbium ions into plasmons and photons.
Cypress Semiconductor Corp., a leading provider of embedded nonvolatile memory solutions, and United Microelectronics Corporation, a leading global semiconductor foundry, today announced that UMC licensed Cypress's SONOS (Silicon Oxide Nitride Oxide Silicon) embedded Flash memory intellectual property (IP) for the 40-nanometer process technology node.
Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that United Microelectronics Corporation, a leading global semiconductor foundry, used Cadence® implementation and signoff tools to produce a silicon-ready 28nm ARM® Cortex®-A7 MPCore-based system on chip (SoC) targeting entry-level smartphones, tablets, high-end wearables and other advanced mobile devices.
Researchers at the University of Copenhagen have developed a new type of superconducting ‘nanowire’ crystal that holds great promise for future semiconducting electronics. These crystals, on the atomic scale, fuse metallic and semiconducting materials.
Global Unichip Corp. (GUC), the Flexible ASIC Leader™, and Credo Semiconductor, a global innovation leader in Serializer-Deserializer (SerDes) technology, today announced they are collaborating to enable the development of high-performance networking solutions that will be manufactured using TSMC's 16-nm FinFET+ process technology.
As he continues to carry out scientific research at the molecular level - holding out the prospect of nano-scale electronics that offer massive increases in processing power - the University of Huddersfield's Dr Nathan Patmore is moving directly from one major award to a prestigious new source of funding.
If the new nano-machines built at The Ohio State University look familiar, it’s because they were designed with full-size mechanical parts such as hinges and pistons in mind.
Chinese IC manufacturer Shanghai Huali Microelectronics Corporation gave a presentation on its outlook for the Internet of Things (IoT) market and the wide application of its specialty technology at the 2014 China Semiconductor Industry Association IC Design Branch Annual Conference, which was recently held at Hong Kong Science Park.
The Universities of Bath, Bristol, Sheffield and Strathclyde and their industrial partners have been given funding to develop the UK into a future hub for the manufacture of advanced semiconductor materials.
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