Posted in | MEMS - NEMS

Forecasts and Strategies Report on the Global MEMS Devices Markets

Research and Markets has announced the addition of the "The Global MEMS Device, Equipment, and Materials Markets: Forecasts and Strategies for Vendors and Foundries" report to their offering.

This vision of MEMS whereby microsensors, microactuators and microelectronics and other technologies, can be integrated onto a single microchip is expected to be one of the most important technological breakthroughs of the future.

A significant portion of MEMS manufacturing technology has come from the IC industry. MEMS devices can be made using silicon wafers and the manufacturing process can incorporates semiconductor manufacturing processes such as sputtering, deposition, etching and lithography.

This report analyzes the market for MEMS devices and the equipment and materials to make them.

Key Topics Covered:

Chapter 1 The MEMS Market Infrastructure

Chapter 2 Forecast Of The Key Applications And Markets
2.1 MEMS Device Market Forecast
2.1.1 Ink Jet Head
2.1.2 Pressure Sensor
2.1.3 Silicon Microphone
2.1.4 Accelerometer
2.1.5 Gyroscope
2.1.6 Micro Display
2.1.7 Other MOEMS
2.1.8 Microfluidics
2.1.9 RF MEMS
2.1.10 Digital Compass
2.1.11 Inertial Sensor
2.1.12 Emerging Applications
2.2 MEMS System Market Forecast
2.2.1 Automotive Systems
2.2.2 Aeronautics Systems
2.2.3 Consumer Systems
2.2.4 Defense Systems
2.2.5 Industrial Systems
2.2.6 Medical/Life Sciences Systems
2.2.7 Telecom Systems

Chapter 3 Markets for Equipment and Materials Suppliers
3.2 MEMS Equipment Markets
3.2.1 Assembly
3.2.2 Bonding
3.2.3 Cleaning
3.2.4 Deposition
3.2.5 Dicing
3.2.6 Etching
3.2.7 Laser Micromachining
3.2.8 Lithography
3.2.9 Metrology/Inspection
3.2.10 Testing
3.2.11 Thermal Treatment
3.2.12 Wafer Thinning
3.3 MEMS Material Markets
3.3.1 Chemicals
3.3.2 Photomasks
3.3.3 Substrates

Chapter 4 MEMS Foundries
4.1 Foundry Profiles and Strategies
4.2 Small-Mid-Sized Companies

Chapter 5 Factors for Foundry Success

Chapter 6 Critical MEMS Issues
6.1 3-D Interconnects and Packaging
6.2 Wafer Size
6.3 MEMS Testing
6.4 Opportunities For Fabless MEMS Companies

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