Posted in | Nanoelectronics

STATS ChipPAC Expands eWLB Technology to Reconstituted 300mm Wafers

STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced that it has expanded the embedded Wafer-Level Ball Grid Array (eWLB) technology to reconstituted 300mm wafers.

STATS ChipPAC is the first in the semiconductor industry to introduce 300mm eWLB wafer manufacturing capabilities.

STATS ChipPAC is firmly established as the leader in eWLB manufacturing volume, capacity and yields, with current quarterly shipments in excess of 30,000 reconstituted wafers and is on track to achieve yields of 99% and above by the end of 2010. By adding capacity through 300mm wafer manufacturing, STATS ChipPAC's customers can benefit from the cost and productivity advantages of eWLB technology on the larger 300mm reconstituted wafer format which provides higher efficiency and economies of scale as compared to the existing 200mm eWLB wafer format. STATS ChipPAC has invested more than US$100 million in eWLB technology. The introduction of 300mm eWLB wafer manufacturing demonstrates the Company's strong focus on leading edge integration technology.

The eWLB technology has already been proven and adopted by many major mobile handset manufacturers to meet the relentless market demand for complex and power efficient semiconductor devices within a continuously shrinking package footprint. STATS ChipPAC is committed to delivering the most cost effective eWLB packaging solution to the market. Through an exclusive alliance with its technology partners, Infineon Technologies AG and STMicroelectronics, STATS ChipPAC jointly developed and is the first in the semiconductor industry to manufacture innovative eWLB technology such as side by side devices embedded in a package, ultra thin eWLB package and two metal layer redistribution. At STATS ChipPAC, development work continues on the eWLB evolution to enable larger package sizes, higher Input/Output (I/O) density and 3D Package on Package (PoP) solutions to address a wider application market.

"The 300mm eWLB wafer manufacturing accomplishment is a milestone for the industry and is the result of leveraging the strengths of STATS ChipPAC and its manufacturing partner, Infineon Technologies. Today, STATS ChipPAC is the world largest and leading volume manufacturer in eWLB and the continued growth of capacity and transition to 300mm wafer manufacturing will further position us to deliver a high performance solution at a lower cost point for our customers," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC. "We believe the exclusive relationship we have with our eWLB technology development partners ensures that STATS ChipPAC will continue to build a strong portfolio of advanced solutions for our customers."


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