Research and Markets has announced the addition of the "Global Wafer-level Packaging Equipment Market 2014-2018" report to their offering.
To sustain the competition in the market, semiconductor manufacturers are continuously introducing innovative products, reducing manufacturing costs, and improving product efficiency. For instance, they have introduced chips that are available in smaller sizes; the sizes of these chips have reduced from 45 nanometers to 22 nanometers. They have also introduced chips with high dielectric constant materials and fin-fet or tri-gate transistors. In addition, DRAM memory manufacturers are currently employing 3x node production technology and 2x node production technology for the production of DRAMs. As these innovations require highly complicated wafer-level packaging equipment, the increase in the number of innovations by semiconductor manufacturers is likely to foster their demand in the market.
According to the report, the most important driver is the increasing adoption of mobile devices. Over the past decade there has been an unprecedented growth in the adoption of mobile devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs. This has led to a consequential rise in the demand for wafer-level packaging equipment, as it is vital for the functioning of mobile devices.
Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry, which leads to fluctuations in the demand for wafer-level packaging equipment. Moreover, in some cases, the production of such equipment tends to exceed their demand, leading to a large demand-supply gap.
Key vendors dominating this space are:
- Applied Materials Inc
- Disco Corp.
- EV Group
- Tokyo Electron Ltd.
- Tokyo Seimitsu Co. Ltd.
Other vendors mentioned in the report are:
- Rudolph Technologies Inc.
- SEMES Co. Ltd.
- Suss Microtec AG
- Ultratech Inc
For more information visit http://www.researchandmarkets.com/research/kxdl6h/global