Nanometrics Announces Expansion of IMPULSE+ Integrated Metrology into 3D-NAND Interconnect Process Control

Nanometrics Incorporated (NASDAQ:NANO), a leading provider of advanced process control systems, today announced that its IMPULSE®+ integrated metrology platform has been adopted into key interconnect process control applications by multiple 3D-NAND customers.

The IMPULSE+ has already been broadly deployed for 3D-NAND memory cell control, and is now being adopted for advanced interconnect control on those devices. With this expansion, the IMPULSE+ with NanoDiffract® software is supporting high-volume manufacturing across all key steps in 3D-NAND production at multiple customers and factories.
 

The IMPULSE+ supports the high throughput and precision needed for advanced interconnect applications, our systems are qualified on the leading chemical mechanical polishing (CMP) systems, providing rapid feedback for advanced process control. After the memory cell and control periphery are completed, enabling high-performance, high-reliability processing of the interconnect circuits by measuring and controlling the metal damascene structures is key.  The IMPULSE+ running NanoDiffract provides this control with advanced thin film and optical critical dimension (OCD) metrology.

Nir Ben-Moshe, senior director of integrated metrology solutions at Nanometrics.

The IMPULSE+ works in conjunction with Nanometrics' NanoDiffract software suite, for OCD modeling and control as well as part of a larger fleet of IMPULSE, Trajectory™ T3 and Atlas® family of systems, to provide comprehensive fab-wide control.  Nanometrics is the industry pioneer in integrated metrology with the broadest suite of offerings qualified on platforms for CMP, deposition, lithography track and etch systems.  The IMPULSE+ can be deployed across key steps in DRAM, 3D-NAND, CMOS image sensor and foundry/logic devices.

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