Ultratech Receives Order from Japan's TOK for Broadband Advanced Packaging Tool - News Item

Ultratech, Inc., a leading supplier of photolithography systems used to manufacture semiconductors and nanotechnology devices, today announced that it has received an order from Tokyo Ohka Kogyo Co., Ltd. for its Prisma-ghi tool. TOK, a leading manufacturer of photoresists for semiconductor and flat panel display fabrication, will use Ultratech's R&D tool for broadband resist development for films used in applications such as gold and solder wafer bumping and high aspect ratio copper interconnects. This is TOK's first Prisma-ghi tool order, and further substantiates Ultratech's technology expertise in resist and materials development for advanced packaging.

Ultratech's Prisma-ghi R&D tool was chosen because it provides a low-cost, broadband projection lithography solution that meets the stringent criteria for advanced packaging and wafer-level, chip scale packaging (WLCSP) customers requiring high aspect ratio films for their gold and solder bump applications. The complementary nature of Ultratech's lithography systems demonstrated significant time savings for customer manufacturing processes. Ultratech's broadband optical platform for the Prisma-ghi enables TOK to develop resists, and then immediately transfer the process to its customers that use Ultratech Saturn Spectrum series production steppers.

Ultratech Senior Vice President and Chief Technical Officer David Markle commented, "Ultratech's Prisma-ghi broadband tool is designed to be compatible with our high-volume line of Saturn Spectrum series steppers. An important factor for customers when making tool-purchasing decisions is the availability of common platforms that provide significant time and cost savings. The Prisma-ghi validates our commitment to supporting all facets of bump and wafer-level packaging lithography, and we're pleased our tools are integral to enabling TOK to reach its photoresist development objectives."

Posted 2nd December 2003

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