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Imec Successfully Develop Mixed-Signal ASIC for Space Applications

Imec has used its design against radiation effects DARE library for the commercial 0.18µm UMC CMOS process to design a mixed-signal application-specific integrated circuit (ASIC) for Tesat-Spacecom.

From IMEC 21 Oct 2010

Milestone in imec's Program on GaN Power Devices

Imec and its partners have successfully fabricated Au-free, Si-processing compatible GaN power devices on a 6 inch Si wafer. This result is a milestone in imec’s industrial affiliation program (IIAP) on GaN power and light-emitting (LED) devices that targets cost reduction as one of the main objectives.

From IMEC 21 Oct 2010

High Resolution Electron-Beam Lithography System to be Installed at University of Leeds

One of the highest resolution electron-beam lithography systems in Europe will soon be helping scientists in Yorkshire break new ground in nanotechnology. The state-of-the art system is to be installed at the Universi...

21 Oct 2010

Intel to Invests Billions on Future Generations of Nanotechnology Manufacturing

Intel Corporation announced today that the company will invest between $6 billion and $8 billion on future generations of manufacturing technology in its American facilities. The action will fund deployment of Intel&rsqu...

20 Oct 2010

Vistec Combines New Air-Bearing Stage Platform with Electron-Beam Lithography Systems

Vistec Electron Beam GmbH announced today that the company is ready to provide its electron-beam lithography systems with a vacuum compatible air-bearing based positioning system overcoming the limitations of roller bear...

From Vistec Electron Beam 20 Oct 2010

AIXTRON Receives Order from MicroLink Devices for MOCVD Reactor

AIXTRON AG today announced a new order for an MOCVD reactor from MicroLink Devices, Inc., USA, a company engaged in the manufacture of HBT devices and the development of III-V solar cells. The Niles, Illinois-based c...

From AIXTRON SE 19 Oct 2010

Maskless Lithography Signs Exclusive Distribution Agreement with Hakuto

Maskless Lithography, Inc., a manufacturer of advanced direct-write digital imaging technology to the printed circuit board (PCB) industry, has signed an exclusive agreement with Hakuto Co. Ltd., Japan, to represent the ...

19 Oct 2010

Scientists Discover New Type of Magnetism Among Titanium Atoms

Theoretical work done at the Department of Energy's Oak Ridge National Laboratory has provided a key to understanding an unexpected magnetism between two dissimilar materials. The results, published in Nature Comm...

From Oak Ridge National Laboratory 19 Oct 2010

Oxford Instruments Plasma Technology Launches Next Generation HBLED Batch Production Tools

Oxford Instruments Plasma Technology is providing outstanding benefits for HBLED manufacturers, with the launch of the PlasmaPro™ NGP®1000 HBLED range of plasma etch and deposition tools. Unparalleled throughpu...

From Oxford Instruments Plasma Technology 18 Oct 2010

New Photolithography Technology from Eulitha for Fabrication of Photonic Nanostructures

Eulitha AG, a Swiss based nanolithography company, has developed a proprietary photolithography technology for low-cost and high-throughput fabrication of photonic nanostructures. This solves a major ongoing problem faced in the fabrication of high-resolution photonic structures using standard photolithography equipment.

From Eulitha AG 18 Oct 2010