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Brion Technologies Introduces New Software for EUV Lithography Process

Next generation semiconductor production will be facilitated by a new product introduced today by Brion Technologies, a division of ASML (NASDAQ:ASML) (Amsterdam:ASML). Brion’s new Tachyon NXE provides accurate ...

15 Sep 2010

Thermoelectric Generators Converting Waste Heat Into Microwatts Of Electrical Power

Most electronic devices use batteries as a power source, but for wireless sensors and medical implants, battery replacement can be a difficult and costly process. Conventional batteries also produce a lot of waste materi...

15 Sep 2010

AIXTRON Receives Follow-Up Order from Long De Xin

AIXTRON AG today announced today a new order for two further CRIUS 31x2-inch configuration deposition systems from Long De Xin. A company based in the PR China, Long De Xin placed the order during the second quarter of 2...

From AIXTRON SE 14 Sep 2010

College of the Canyons Expands Nanotechnology Educational Offerings

NanoProfessor, a division of NanoInk, Inc.® focused on nanotechnology education, announced today that College of the Canyons in Santa Clarita, California has aquired the NanoProfessor Nanoscience Education Program to supplement its current nanotechnology educational offerings.

14 Sep 2010

Carl Zeiss Introduces New Metrology System at SPIE Photomask Conference

Carl Zeiss introduces its PROVE™ Registration and Overlay Metrology System for photomasks at SPIE Photomask Conference in Monterey, California.

14 Sep 2010

Altatech Semiconductor's JetLab Nanoprinting System to be Installed at Nanotechnology Center in Italy

To further enable its research in direct-write printing of micro- and nanoscale electronic devices, the Italian Institute of Technology's (IIT) Center for Nanoscience and Technology has purchased a JetLab® 4xl-A ...

14 Sep 2010

Applied Materials Introduces Aera3 Mask Inspection System

Applied Materials, Inc. today announced its Applied Aera3™ Mask Inspection system, enabling photomask and chip manufacturers to meet the most critical defect detection challenges for all photomasks at 22nm, using its proven aerial imaging technology.

From Applied Materials Inc. 14 Sep 2010

Fab Owners Association Announces Membership Numbers Reached 63

The Fab Owners Association (FOA), the association of semiconductor device manufacturing executives and suppliers, has announced that its membership has reached 63 members with the addition of several new members. New dev...

13 Sep 2010

Carl Zeiss Launches New Photomask Registration System

Carl Zeiss introduces its PROVE™ Registration and Overlay Metrology System for photomasks at SPIE Photomask Conference in Monterey / CA. PROVE™ measures image placement on photomasks with superior resolution meeting the challenging requirements of the 32nm technology node and beyond.

From Carl Zeiss Microscopy GmbH 13 Sep 2010

Toppan Printing Develops New Photomask Process for 22nm and 20nm Devices

Toppan Printing Co., Ltd. today announced that it has developed a photomask manufacturing process at its facility in Asaka, Japan, to support 22nm and 20nm semiconductor device production. This process was developed t...

From Toppan Photomasks Inc. 10 Sep 2010