Nanofabrication News

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Research and Markets Announces Availability of Introduction to Microfluidics Report

Research and Markets has announced the addition of the "Introduction to Microfluidics" report to their offering. Microfluidics is a young discipline which enables scientists and engineers to handle fluids i...

28 Jul 2008

HelioVolt and NREL Wins R+D 100 Award for Work in Thin Film PV Systems

HelioVolt Corporation, a producer of highly-efficient thin film solar energy products, today announced that it has garnered an R&D 100 Award from Research & Development (R&D) Magazine for work performed in pa...

24 Jul 2008

Researchers Produced LEDs on Low-Cost Metal-Coated Silicon Wafers

Researchers at Purdue University have overcome a major obstacle in reducing the cost of "solid state lighting," a technology that could cut electricity consumption by 10 percent if widely adopted.

18 Jul 2008

Producing Hydrogen Using Water, Solar Energy and Nanotube Diodes

A greener, less expensive method to produce hydrogen for fuel may eventually be possible with the help of water, solar energy and nanotube diodes that use the entire spectrum of the sun's energy, according to Penn St...

16 Jul 2008

eHARP system Extending Proven Gap-Fill Technology for Critical STI Device Structures to 32nm and Beyond

The eHARP process delivers void-free films to fill <30nm, >12:1 aspect ratio features - essential requirements for the fabrication of advanced memory and logic devices. Featuring proprietary new process innovations, the eHARP system's robust, high-density, strain-inducing films enable the scaling of conventional planar and emerging 3-D device structures.

15 Jul 2008

Depositing Critical Barrier Films for Copper Interconnects in Sub-55nm Memory Chips

Applied Materials, Inc. today announced its Applied Endura® Extensa(TM) PVD1, the industry's only production-worthy system for depositing the critical barrier films for copper interconnects in sub-55nm memory chips.

15 Jul 2008

New Tools and Processes Designed to Enable Next-Generation MEMS Development

To meet the need for advanced micro-electromechanical systems (MEMS) tools, SVTC Technologies, a leading independent semiconductor process-development foundry, announced that it has expanded its capabilities to enable cu...

15 Jul 2008

IQ Aligner Selected for its UV Nanoimprint Lithography Capability

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Heptagon Micro-Optics Pte Ltd. in Singapore -- a wholly-owned sub...

15 Jul 2008

Oxford Instruments Plasma Technology Launches Latest Customer Support Package

Oxford Instruments Plasma Technology (OIPT), part of Oxford Instruments plc, is pleased to announce the recent launch of its latest customer support package, the 'Pre-Purchased Service Fund' scheme.

15 Jul 2008

32nm SRAM Fabricated Using EUV Technology

IMEC reports functional 0.186µm2 32nm SRAM cells made with FinFETs from which the contact layer was successfully printed using ASML's full field extreme ultraviolet (EUV) Alpha Demo Tool (ADT). Applied Materials, using its most advanced deposition systems, was key to fabricating the ultra-small circuit structures.

15 Jul 2008