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CHAD Industries Deploys Completely Automated Bond Shear Inspection Workcells for 300 mm Wafers

CHAD Industries has declared that it has completed the installation of several completely automated bond shear inspection workcells for its 300 mm wafer applications.

17 Dec 2011

Renesas Electronics Designs First 40 nm Flash Memory Technology IP

Renesas Electronics, a company specializing in advanced flash design and semiconductor solutions, has declared that it has designed the first-of-its-kind 40 nm memory intellectual property (IP) for real-time applications in the automotive industry.

16 Dec 2011

ARM, GLOBALFOUNDRIES Announce Launch of 28 nm SoC Test Chip

ARM and GLOBALFOUNDRIES have introduced the first-its-kind 28 nm dual-core Cortex-A9 processor-based SoC test chip operating at over 2.5 GHz frequency. They have also announced the tape out of Cortex-A9 processor-based SoCs utilizing 20 nm technology qualification vehicle (TQV) of GLOBALFOUNDRIES.

From GlobalFoundries 16 Dec 2011

Delrus Inks LOI to Distribute MagForce’s NanoTherm Therapy in Russia and Kazakhstan

Nanostart’s subsidiary, MagForce, a nanomedicine company specializing in oncology, has signed a letter of intent (LOI) with Delrus, a distributor of medical products based in Russia.

From Coreo AG 16 Dec 2011

GLOBALFOUNDRIES Achieves Silicon Success for 20 nm Chip Using Synopsys’ IC Compiler-AG

Synopsys has declared that GLOBALFOUNDRIES has achieved silicon success for its first major 20 nm chip using Synopsys’ IC Compiler-Advanced Geometry (AG), which is the 20-nm version of IC Compiler.

From GlobalFoundries 16 Dec 2011

STMicroelectronics Produces World's First Semiconductor Wafer Using EMWS Technology

STMicroelectronics has declared that it has successfully produced first-of-its-kind semiconductor wafer, whose dice were completely tested devoid of contact probes.

From STMicroelectronics 16 Dec 2011

eSilicon Licenses 40 nm Silicon-Proven TCAM Macros to HiSilicon Technologies

HiSilicon Technologies, a company specializing in semiconductor designs for consumer electronics and communication industries, has become the licensee of eSilicon’s 40 nm silicon-proven ternary content-addressable memory (TCAM) macros for use in its future-generation, superior-performance network-application ASICs.

16 Dec 2011

Vorbeck Materials Secures Fund to Expand Sales of Graphene-Based Vor-ink for Printed Electronics

Vorbeck Materials has declared that it has wrapped up a completely subscribed series 3 funding with a total amount of $10 million. The funding was completed on 9 December 2011. Fairbridge Venture Partners and Black Powder were the companies which led the funding that also comprised 15 more investors.

From Vorbeck Materials 15 Dec 2011

FSI International Obtains Follow-On Orders for ORION Single Wafer and ANTARES Cryokinetic Cleaning Systems

FSI International, a provider of surface conditioning devices for the production of microelectronics, has declared that a major semiconductor manufacturer has placed a follow-on order for the company’s ORION single wafer cleaning system for back-end-of-line applications.

15 Dec 2011

Roane State Community College Receives Scanning Electron Microscope from RJ Lee Group

A scanning electron microscope (SEM) worth $75,000 has been donated by RJ Lee Group, a Monroeville, Pennsylvania-based industrial forensics laboratory, to the Roane State Community College (RSCC) campus located in Oak Ridge, Tennessee.

From RJ Lee Group Inc. 14 Dec 2011

Nanobusiness News

CHAD Industries Deploys Completely Automated Bond Shear Inspection Workcells for 300 mm Wafers

Renesas Electronics Designs First 40 nm Flash Memory Technology IP

ARM, GLOBALFOUNDRIES Announce Launch of 28 nm SoC Test Chip

Delrus Inks LOI to Distribute MagForce’s NanoTherm Therapy in Russia and Kazakhstan

GLOBALFOUNDRIES Achieves Silicon Success for 20 nm Chip Using Synopsys’ IC Compiler-AG

STMicroelectronics Produces World's First Semiconductor Wafer Using EMWS Technology

eSilicon Licenses 40 nm Silicon-Proven TCAM Macros to HiSilicon Technologies

Vorbeck Materials Secures Fund to Expand Sales of Graphene-Based Vor-ink for Printed Electronics

FSI International Obtains Follow-On Orders for ORION Single Wafer and ANTARES Cryokinetic Cleaning Systems

Roane State Community College Receives Scanning Electron Microscope from RJ Lee Group

Cigarette Waste as a Source for Sustainable Supercapacitors

Laser-Induced Graphene for Printable and Biomedical Applications

Co-Solvent-Driven Laser Assembly of Gold Nanorods

Novel Technique Dramatically Increases Graphene's Elasticity

Nanotubes Stabilize Carbyne, Paving Way for Advanced Electronics

Breaking Barriers in Thin-Film Deposition with ATLANT 3D’s DALP Technology

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

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