Texas Instruments (TI) today introduced five new next-generation power management integrated circuits that efficiently acquire and manage microwatts (uW) to milliwatts (mW) of power harvested from light, heat or mechanical energy sources. The bq25570, bq25505, TPS62740, TPS62737 and TPS62736 maintain the industry’s lowest levels of active quiescent current and enable battery-free operation to wireless sensor networks, monitoring systems, wearable medical devices, mobile accessories and other applications with limited access to power.
Using foam substrates, EPFL scientists were able to make a flexible electronic circuit board. This discovery could lead to the creation of deformable and stretchable circuits.
When it comes to the growth of graphene — an ultrathin, ultrastrong, all-carbon material — it is survival of the fittest, according to researchers at The University of Texas at Austin.
Gold Standard Simulations (GSS) revealed today that TSMC has adopted the company's advanced statistical compact model extraction tool Mystic for TCAD device analysis.
Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that IO Semiconductor Inc. (IOsemi), a fabless semiconductor company developing high-performance RF front-end devices for multi-band, multi-mode cellular applications, has selected the company’s Analog FastSPICE™ AMS (AFS AMS) for RF front-end mixed-signal design verification.
Xilinx, Inc. today announced first customer shipment of the semiconductor industry's first 20nm product manufactured by TSMC, and the PLD industry's first 20nm All Programmable device. Xilinx UltraScale™ devices deliver an ASIC-class advantage with the industry's only ASIC-class programmable architecture coupled with the Vivado® ASIC-strength design suite and recently introduced UltraFast™ design methodology.
XMC, a fast growing specialty foundry, today announced it has opened an office in California's Silicon Valley to support the growing interest and demand for its semiconductor manufacturing offerings. The office will be the base for front-line sales and business development efforts in North America. It will be headed by industry veteran Keng Wong, who has been named Associate Vice President of US Sales.
Vishay Intertechnology, Inc. is broadening its optoelectronics portfolio with the introduction of two new 940 nm high-speed infrared emitting diodes in compact 3.2 mm by 2.51 mm by 1.2 mm clear SMD side-view packages. Based on GaAIAs surface emitter and multi quantum well (MQW) technologies, the VSMY14940 and VSMB14940 combine high radiant intensity and optical power with fast switching times.
SilTerra Malaysia Sdn. Bhd., a Malaysian home grown leading semiconductor wafer foundry, and Chip Memory Technology, Inc, an innovative memory IP design house, jointly announced today the production release of Multiple-Time-Programming (MTP) embedded non-volatile memory solution in SilTerra’s advanced 110nm High Voltage technology.
Nanoelectronics research center imec announced today that the Howard Hughes Medical Institute (HHMI), the Allen Institute for Brain Science, the Gatsby Charitable Foundation, the Wellcome Trust, and University College Lo...
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