Electronic products pollute our environment with a number of heavy metals before, during and after they're used.
Magma® Design Automation, a provider of chip design software, today announced TowerJazz, the global specialty foundry leader, has qualified the Titan™ Mixed-Signal Design Platform for TowerJazz's Power Management Analog/Mixed-Signal (AMS) Reference Flow and process design kits (iPDKs) for its 180-nanometer (nm) technologies.
Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced immediate availability of the DesignWare® MIPI M-PHY® IP for next-generation high-speed interfaces based on the newly ratified MIPI® Alliance M-PHY specification.
Using powerful lasers, Hui Zhao, assistant professor of physics and astronomy at the University of Kansas, and graduate student Lalani Werake have discovered a new way to recognize currents of spinning electrons within a...
Future flash memory could be faster and store more data without changing its basic design by using a clever nanocrystal material proposed by scientists at Taiwan's Chang Gung University, who describe a new logical el...
Berkeley Design Automation, Inc., provider of the Analog FastSPICE™ unified circuit verification platform (AFS Platform) today announced that Alps Electric Co. Ltd., a leading global manufacturer of electronic components for mobile devices, home electronics, automotive vehicles, and industrial equipment, has deployed the AFS Platform for complex-block characterization, device noise analysis, and mixed-signal verification of its complex mixed-signal ICs.
Applied Materials, Inc. today announced its breakthrough Applied Producer® Eterna™ FCVD™ (Flowable CVD1) system, the first and only film deposition technology capable of electrically isolating the densely-packed transistors in 20nm-and-below memory and logic chip designs with a high-quality dielectric film.
MEMSIC, Inc., a leading innovator of MEMS sensors and systems solutions, today announced its next-generation family of high-performance MEMS inertial systems.
Photonic integrated circuits (PICs), in which photons carry out signal processing, are expected to play a crucial role in next-generation computing and communication systems. Much progress has been made over the last decade toward realizing all-optical circuits on a chip.
The Global Silicon-on-Insulator (SOI) Market report sizes and analyzes the global markets for SOI wafers types and applications over the period 2010-2015. The report studies the major market drivers, restraints, an...
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