Lasertec Corporation of Japan has joined SEMATECH’s 3D Interconnect Program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, and will partner with SEMATECH to develop robust, cost-effective process metrology technology solutions for readying high-volume via-mid through-silicon via (TSV) manufacturing.
Powerful new microscopes able to resolve DNA molecules with visible light, superfast computers that use light rather than electronic signals to process information, and Harry Potteresque invisibility cloaks are just some of the many thrilling promises of transformation optics.
Applied DNA Sciences, Inc. (OTCBB: APDN), a provider of DNA-based security solutions, and H.W. Sands Corp., a trusted leader in the global market for advancing security, chemical and card industries, announced the signing of an Agreement to jointly market and sell DNA security-based solutions to clients that are dedicated to protecting their products, supply chains and end consumers from counterfeiting and gray market diversion.
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG610 mask and bond aligner, specific...
Qcept Technologies Inc. today introduced its latest non-visual defect (NVD) inspection system--the ChemetriQ® 5000. Providing NVD inspection on both patterned and unpatterned wafers, the ChemetriQ 5000 can be used f...
Sir Michael Pepper at London Centre for Nanotechnology has been awarded a Gold Medal of the Institute of Physics for Business and Innovation. The citation reads: For translating advances in semiconductor physics into the commercial arena, including key roles in founding Toshiba Research Europe, Cambridge Laboratory, and TeraView Ltd.
AIXTRON AG (FSE: AIXA; NASDAQ: AIXG) announced today a new order for six CRIUS II 55x2-inch configuration deposition systems from Hangzhou Silan Microelectronics Co., Ltd., 'SILAN'.
The Hangzhou, PR China bas...
Stoke-on-Trent (UK), Ceram, a global expert in materials testing, analysis and consultancy, has published a new white paper outlining the advantages of employing a range of modern surface characterisation techniques to obtain quantitative chemical and physical information on the structure and composition of semiconductor materials.
Scientists from Singapore A*STAR’s Institute of Materials Research and Engineering (IMRE), University of Cambridge (UK) and Sungkyunkwan University (South Korea) have created metallic lines so thin and smooth that ...
NEXX Systems, a leading provider of processing equipment for advanced wafer-level packaging applications, today announced the shipment of its 50th Stratus electrochemical deposition system, to be installed at a Taiwanese foundry.
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