Methode Development Company, a business unit of Methode Electronics, Inc., announces that its conductive inkjet printable ink can now print circuits directly onto treated polyesters.
The ink, formulated for...
Atmel® Corporation, a leader in microcontroller and touch solutions, today announced that it has completed the previously announced sale of Atmel's wafer fabrication operation located in Rousset, France to LFoundry GmbH.
IBM, Samsung Electronics, Co., Ltd., GLOBALFOUNDRIES and STMicroelectronics said today that the four companies are collaborating to synchronize semiconductor manufacturing facilities for the production of advanced chips based on 28nm process jointly developed by IBM Technology Alliance.
The remarkable ability of an electron to exist in two places at once has been controlled in the most common electronic material – silicon - for the first time.
Organic semiconductors are very promising candidates as starting materials for the manufacture of cheap, large area and flexible electronic components such as transistors, diodes and sensors on a scale ranging from micro to nano.
Embarking on a new era of microcontroller (MCU) leadership, Freescale Semiconductor today announced the Kinetis family of 90 nanometer (nm) 32-bit MCUs based on the new ARM® Cortex-M4 processor.
MunEDA's tool suite WiCkeD(TM) has been validated for TSMC’s RF Reference Design Kit (RDK) 2.0 as part of the TSMC Open Innovation Platform(TM). WiCkeD covers a wide range of topic in interactive and automatic specification-driven custom circuit design, including design centering, circuit sizing for performance and yield, performance analysis, statistical circuit analysis.
Berkeley Design Automation, Inc., provider of the Analog FastSPICE™ unified circuit verification platform (AFS Platform), today announced that Technology Leaders & Innovators (TLi), a leading fabless developer of display semiconductor products, has selected the AFS Platform for full-circuit verification and device noise analysis of its complex mixed-signal ICs for display applications.
MOSIS, CMP and CMC are partnering to offer a 3D-IC Multi-Project Wafer (MPW) service based on Tezzaron Semiconductor's SuperContact technology and GLOBALFOUNDRIES' 130nm CMOS process.
The first MPW run is t...
What could be better than diamond when it comes to a superhard material for electronics under extreme thermal and pressure conditions? Quite possibly BC5, a diamond-like material with an extremely high boron content...
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