Cork Science Cafe Explores How Thinking Small is Pushing Technology Forwards
CIT Cork Institute of Technology’s Blackrock Castle Observatory (BCO) in association with UCC, Tyndall National Institute, CIT, the Co...
2009 was the year in which the industry's belief in the feasibility of EUV grew strongly – a belief underpinned by our results. Using EUV lithography, we fabricated the world's first functional 22nm SRAM cell. An extremely small memory cell, but representing a huge technical and logistical challenge.
Integrated Device Technology, Inc. today announced the availability of its all-silicon CMOS oscillators, the MM8202 and the MM8102 in wafer and package forms, making IDT the only company to offer quartz-crystal-level performance with a CMOS oscillator in both forms.
Students in introductory chemistry classes often start off with learning how to balance chemical equations.
Research and Markets (http://www.researchandmarkets.com/research/f84640/inorganic_and_comp) has announced the addition of the "Inorganic and Composite Printed Electronics 2010-2020" report to their offering.
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A researcher at North Carolina State University has developed a computer chip that can store an unprecedented amount of data – enough to hold an entire library's worth of information on a single chip. The new chip s...
Synapse Wireless®, Inc. and Silicon Laboratories Inc. (NASDAQ: SLAB) today introduced a jointly developed wireless mesh networking solution that combines the award-winning Synapse SNAP® network operating system with...
SVTC Technologies, the leading commercialization service provider for new, emerging silicon-based technologies in areas such as CMOS, MEMS, photovoltaics and other related nanotechnologies, is pleased to announce that it is now offering ITAR compliant development and manufacturing services, allowing customers to develop process technologies and manufacture products with potential defense applications.
"Hot sounds" has one meaning to music fans and another to physicists. Count a team of researchers at Rice University among the latter, as they've discovered that acoustic waves traveling along ribbons of graphene might be just the ticket for removing heat from very tiny electronic devices.
To continue the industry's historical trend of performance scaling, SEMATECH experts reported on integrated approaches to CMOS logic and memory device technology and 3D TSV (through silicon via) manufacturing at the International Symposium on VLSI Technology, System and Applications (VLSI-TSA) on April 26-28, 2010.
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