Nanoelectronics News

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Standard Gas Stick Minimizing Lead Times for Semiconductor Tool Installations

Standard Gas Stick Minimizing Lead Times for Semiconductor Tool Installations

30 Jul 2009

Cadence CPF-based Low Power Flow and Integrated DFM Capabilities Enable Simplified Advanced Node Design Methodology for UMC Customers

From Cadence Design Systems 30 Jul 2009

CTS Electronic Components Awarded Contract from a Major Industrial Manufacturer

30 Jul 2009

Corning and Soitec Group Announces Agreement on Developing High-Performance Silicon-on-Glass Substrates for Flat Panel Mobile Display Market

From The Soitec Group 30 Jul 2009

ASM Receives Order for Pulsar ALD System from Japanese Logic Device Manufacturers

From ASM International 29 Jul 2009

Companies Scrambling to Find Unconventional Ways to Increase Revenue and Maximize Assets

29 Jul 2009
Research into Graphene Nanoribbons Provides New Reasons for Using it as Interconnects In Future Computer Chips

Research into Graphene Nanoribbons Provides New Reasons for Using it as Interconnects In Future Computer Chips

29 Jul 2009

Improved Modeling Enables Encounter Digital Implementation System to Accelerate Advanced Node Design

From Cadence Design Systems 29 Jul 2009

Strasbaugh Receives Order for nFinity Prime Wafer Polishers

29 Jul 2009

Virage Logic Extends Advanced IP Technology Leadership to the 32/28-Nanometer Process Node

29 Jul 2009

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