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UVISEL VUV Phase Modulated Spectroscopic Ellipsometer From HORIBA Scientific Extended Down To 140nm

UVISEL VUV Phase Modulated Spectroscopic Ellipsometer From HORIBA Scientific Extended Down To 140nm

The introduction of the UVISEL VUV phase modulated spectroscopic ellipsometer from HORIBA Scientific extends the performance capabilities of the UVISEL series down to 140 nm. This energy range is becoming increasingly im...

From HORIBA 22 Aug 2007

$High Accuracy Measurement of Film Thickness, Refractive Index and Reflectivity of Thin Films and Multilayer Stacks From HORIBA Scientific$

High Accuracy Measurement of Film Thickness, Refractive Index and Reflectivity of Thin Films and Multilayer Stacks From HORIBA Scientific

Horiba Scientific has extended the performance capability of the UVISEL spectroscopic phase modulated ellipsometer with the integration of the VIP DUV Spectroscopic reflectometer. The combination of high precision ellips...

From HORIBA 22 Aug 2007

GE Acquires Leader in High-resolution Computed tomography (CT) and X-ray Technology

GE Inspection Technologies has signed a definitive agreement to acquire phoenix|x-ray, a leader in high-resolution computed tomography (CT) / X-ray technology used in non-destructive testing (NDT) applications. The trans...

22 Aug 2007

Dendrimer Based Chip For Photonic Devices Featured at nanoTX’07

The award winning nanophotonic integrated circuit (nPIC) of Applied Research & Photonics (ARP) will be a highlight during International Nanotechnology Week, a presentation of the Semiconductor Industry Association.&n...

22 Aug 2007

FutureCarbon to Use Bayer Nanotubes to Manufacture Aqueous Nano Dispersions

Carbon nanotubes, also known as CNT for short, offer great potential in the field of material sciences. Their market potential for the next few years is estimated at several thousand tons a year. Bayer MaterialScience AG...

22 Aug 2007

Next-Generation Optical Metrology System for Semiconductor Packaging Inspection from Veeco

Veeco Instruments Inc., today announced the release of its latest generation of industry-leading SP products for backend semiconductor metrology. The Wyko(R) SP9900(TM) Surface Profiling System performs critical measurem...

21 Aug 2007

Increased Applications For Anchor’s NanoScope DFM Platform

Anchor Semiconductor, the pioneer and technology leader in design-for-manufacturing (DFM) solutions for controlling layout-to-silicon pattern transfer, and Dongbu HiTek, the biggest pure-play foundry in Korea, jointly an...

21 Aug 2007

Japanese Manufacturer Buys Tegal Etch System to Make Photoresist Strip

Tegal Corporation, a leading designer and manufacturer of plasma etch and deposition systems used in the production of integrated circuits, MEMS, and nanotechnology devices, today announced that it has received an order ...

From Collabrx, Inc. 17 Aug 2007

Tailoring the Resistance of Semiconductors Using a Nano Blasting Technique

A new process for adjusting the resistance of semiconductor devices by carpeting a small area of the device with tiny pits, like a yard dug up by demented terriers, may be the key to a new class of magnetic sensors, enab...

From National Institute of Standards and Tech (NIST) 17 Aug 2007

New Production Method For Nanogap Electrodes Points The Way To Nanoscale Electronics

Researchers at the University of Pennsylvania have developed a reliable, reproducible method for parallel fabrication of multiple nanogap electrodes, a development crucial to the creation of mass-produced nanoscale elect...

From Nanogap 17 Aug 2007

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