ESI Bolster its Technology Offerings for 3D IC Packaging and Memory Repair Product Applications

Electro Scientific Industries, Inc. (Nasdaq:ESIO), a leading provider of world-class photonic systems for microengineering, today announced that it has bolstered its technology offerings for both its 3D IC packaging and memory repair product applications.

Through the acquisition of thin wafer dicing and TSV drilling intellectual property (IP) rights of Xsil, ESI has enhanced its technology and product portfolio to enable competitive advantages for its customers for 3D IC packaging applications. The acquired assets further strengthen ESI’s 3D IC packaging offerings with full laser-dicing capability for thin wafers as well as fine pitch through-silicon via (TSV) drilling.

In addition, ESI’s recent introduction of an innovative new memory repair system, the 9850TP, reflects continued leadership in memory repair applications. ESI’s 9850 Tailored Pulse laser repair system was recently qualified by a major DRAM manufacturer for next generation DRAM devices. ESI’s customers realize tremendous cost and technology advantages due to its expanded memory repair product line.

“ESI is committed to advancing our customers’ product and technology roadmaps,” said Louis Vintro, vice president and general manager of ESI’s semiconductor products group. “To do this, we are continually investing in R&D to provide new, innovative solutions that improve our customers’ manufacturing efficiencies. The IP acquisition in 3D IC packaging technology and the selection of our 9850TP laser system demonstrate ESI’s ongoing commitment to meet future challenges in semiconductor manufacturing.”

ESI will be at SEMICON West 2009

To learn more about the latest innovations, visit ESI at Booth #2406, in the South Hall during SEMICON West 2009 held July 14-16 at San Francisco’s Moscone Convention Center.

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