Synopsys, Inc. (NASDAQ: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced a special three-way technical session and breakfast at ARM TechCon3 hosted by ARM®, the Common Platform™ (IBM, Chartered Semiconductor Manufacturing and Samsung Electronics) alliance and Synopsys. The session hosts will discuss the new level of collaboration necessary to address the cost and technical challenges associated with advanced mobile SoC design and manufacturing.
As semiconductor technology approaches fundamental physical limits and design complexity reaches unprecedented levels, a deeper type of technical alignment is essential. Attendees will learn how the extended collaboration among the seminar hosts enables designers to deliver optimized ARM( )processor-based 32/28LP mobile SoC designs while achieving faster time-to-market at reduced risk and design cost. The presenters will also explain how the collaboration is enabling a proven turnkey design solution for optimizing innovation and accelerating designs with best-in-class technology, physical and processor IP, and tool/flow solutions for the Common Platform's 32nm/28LP high-k metal-gate (HKMG) process technology.