Aug 17 2010
FlipChip International (FCI) today announced that it has signed a patent license agreement with Cookson Electronics covering its intention to facilitate the industry's ease in adopting the use of Polymer Collar™ technology to enhance the drop-shock and thermal cycling reliability of area array packages, particularly wafer level packages used for hand-held devices.
By purchasing polymer flux from Cookson, package manufacturers will be permitted to practice the Polymer Collar™ process without the concern of patent infringement.
"FCI has developed some valuable IP for the industry. We have found that most of the leading package suppliers to the hand-held market have a strong interest in Polymer Collar™ technology, but have been reluctant to implement the technology due to their concern over possible patent infringement," said Chris Bastecki, Vice President and General Manager at Cookson Electronics Semiconductor Products. "This license agreement really opens the path and facilitates the full industry utilization of this enabling technology," continued Bastecki.
Bob Forcier, Chief Executive Officer at Flip Chip International, said, "We are excited by our continued technical advancements and in our ability to develop enabling, green technologies that can advance performance and miniaturization for the mobile market. The Polymer Collar™ process has the potential to expand the use of wafer level packages to larger die sizes and increased functionality."
Source: http://www.flipchip.com/