Posted in | News | Nanofabrication

New Excimer Laser Debonder from SUSS MicroTec

SÜSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has launched an excimer laser debonder, the ELD300, for the stress free debonding of 200 and 300mm 3D-IC wafers, today.

The laser debonder can be used as a stand-alone, semi-automated system or as an integrated process module in SUSS MicroTec's XBC300 Gen2 platform. The debonding method used in the ELD300 relies on a 308nm Excimer laser to separate the glass carrier from a tape mounted thin wafer. The ultraviolet light of the pulsed laser beam is absorbed in the adhesive or in an optional UV absorption layer within a few hundred nanometers. The absorbed energy breaks the chemical bonds in the adhesive or absorption layer without generating thermal stress on the thin device wafer so that the glass carrier can easily be lifted off after the debonding process. With the alternative module for mechanical peel-off debonding and the modules for post-debond cleaning of tape mounted thin wafers or carrier wafers, SUSS MicroTec's XBC300 Gen2 platform offers a full solution package for debonding and cleaning applications.

The ELD300 mainly focuses on 2.5D and 3D-IC applications but also addresses the requirements in the areas of 3D MEMS, CMOS Image Sensors and power devices. The main competitive advantages of Excimer laser assisted debonding with the ELD300 are the short process times which result in high throughput, the debonding selectivity of the process, the absence of mechanical or thermal stress on the thin device wafer and eventually the high degree of automation which is of essence for high volume manufacturing.

"With the launch of the ELD300 SUSS MicroTec now offers two dedicated solutions for room temperature debonding: mechanical peel-off and Excimer laser assisted processes.", says Frank P. Averdung, President and CEO of SUSS MicroTec AG. "We see ourselves well positioned for the challenging tasks that can be expected from high volume production of 3D-ICs."

About SUSS MicroTec SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit



Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    SUSS MicroTec AG. (2019, February 11). New Excimer Laser Debonder from SUSS MicroTec. AZoNano. Retrieved on April 20, 2024 from

  • MLA

    SUSS MicroTec AG. "New Excimer Laser Debonder from SUSS MicroTec". AZoNano. 20 April 2024. <>.

  • Chicago

    SUSS MicroTec AG. "New Excimer Laser Debonder from SUSS MicroTec". AZoNano. (accessed April 20, 2024).

  • Harvard

    SUSS MicroTec AG. 2019. New Excimer Laser Debonder from SUSS MicroTec. AZoNano, viewed 20 April 2024,

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.