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NEXX Systems Announces Participation in IMEC's IIAP on 3D Integration

NEXX Systems, a leading provider of process equipment for advanced wafer-level packaging applications, today announced its participation in IMEC's Industrial Affiliation Program (IIAP) on 3D integration. As a member of this program, NEXX Systems will install a Stratus S300-FX electrodeposition system at IMEC's facility in Leuven, Belgium for joint research and development of the metallization of through silicon vias (TSVs) and micro-bumping. The TSVs and micro-bumps are fabricated with electrodeposition technology and play a key role in 3D integration.

"We are delighted to continue our partnership with NEXX Systems and are confident that the Stratus will give our partners leading-edge electrodeposition technology for 3D integration," explained Eric Beyne, program director of the Advanced Packaging and Interconnect Center at IMEC.

"3D integration is an exciting new technology that addresses the ever-increasing demands for smaller, more complex, electronic devices," said Richard Post, NEXX's CEO. "Our partnership with IMEC will enhance continuing efforts to develop robust, low cost electroplating solutions that will enable future products for consumer electronics as well as automotive, medical, and office networking applications."

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