Jul 30 2008
Ultratech, Inc., a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices, today announced it received multiple orders from one of the largest memory manufacturers in the world for its AP300 advanced-packaging (AP) lithography tool. Building on the success of its AP300 installed base, this customer will use Ultratech's lithography systems to expand capacity for advanced-packaging applications, such as chip stacking. The AP300 is built on Ultratech's customizable Unity Platform(TM), which provides cost-of-ownership (CoO) benefits, operational flexibility and technology extendibility for advanced packaging. Ultratech's AP300 systems will be delivered to the customer's manufacturing facility in Asia.
"The increasing adoption of advanced-packaging technology for chip stacking applications is fueling additional growth opportunities for Ultratech," said Manish Ranjan, director, product marketing at Ultratech. "Our product offerings deliver outstanding economic value for cost-sensitive markets such as the memory segment. These orders validate the AP300 lithography system as the industry standard for advanced-packaging applications. We greatly value our strong relationship with this strategic customer and look forward to supporting their capacity expansion efforts."