TLMI, strategically located in Austin, TX, is dedicated to delivering the highest customer satisfaction and most advanced technology in end-to-end, turn key wafer flip chip fabrication services in North America. The focus of our Austin facility is on prototype development of all types of bumping requirements, initial production ramps, and specialty bumping and flip chip interconnect applications that require a high degree of engineering skill. TLMI can help with transferring your device to any high volume wafer bumping company.
Professor Andre Nel
In this interview, AZoNano speaks with Professor Andre Nel about his involvement in innovative research describing the development of a 'glass bubble' nanocarrier that could help drug formulations access pancreatic cancer cells.
Jingang Li, Ph.D.
In this interview, AZoNano speaks with Jingang Li from the University of California, Berkley, who offers an introduction to the Nobel Prize-winning technology, Optical Tweezers.
Steve Kosier, Ph.D.
In this interview, we speak with SkyWater Technology about the current state of the semiconductor industry, how nanotechnology has helped to shape this sector, and their new partnership which aims to increase the accessibility of semiconductor chips for start-ups and research groups across the Unite
NMR spectroscopy is a characterization technique that is extensively used by chemical researchers.
Inoveno’s PE-550 is a best-selling electrospinning/spraying machine that can be used for the continuous production of nanofibers.
The Filmetrics R54 advanced sheet resistance mapping tool for semiconductor and compound semiconductor wafers.