TLMI, strategically located in Austin, TX, is dedicated to delivering the highest customer satisfaction and most advanced technology in end-to-end, turn key wafer flip chip fabrication services in North America. The focus of our Austin facility is on prototype development of all types of bumping requirements, initial production ramps, and specialty bumping and flip chip interconnect applications that require a high degree of engineering skill. TLMI can help with transferring your device to any high volume wafer bumping company.
Dr. Yitong Dong
Dr. Yitong Dong has recently been awarded funding to study custom composite nanocrystals, which could help to create advanced quantum communication technologies. Learn more about this project in this interview.
Roey Elnathan, Ph.D.
We take a closer look at the fusion of nanotechnology and CAR-T therapy through our interview with Dr. Roey Elnathan about a new approach that harnesses the capabilities of nanoneedles to efficiently deliver genetic materials to target cells.
In this interview, Laura-Isabelle, the Director of Sales at Photon etc., talks to AzoNano about how spectral imaging can help improve the next generation of solar cells.
The Verifire™ interferometer system provides fast and reliable measurements of surface form error.
Discover the compact, fast rotary table V-610 for precision testing and manufacture.
The Diamond Interaction Chamber (DIXC) is integral to the NanoGenizer high-pressure homogenizer.