Nanolithography News

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Research and Markets Adds Report on Global Atomic Layer Deposition Market 2014 - 2018

Research and Markets has announced the addition of the "Global Atomic Layer Deposition Market 2014-2018" report to their offering.

From Research and Markets 26 Apr 2014

New Mask Aligner MA200 Gen3 Tool for High Volume Manufacturing Launched by SÜSS MicroTec

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the new Mask Aligner MA200 Gen3 today. The tool is designed for high volume manufacturing and can be used for exposing wafers with a diameter of up to 200 mm.

From SUSS MicroTec AG 4 Apr 2014

OAI Unveils New Non-Contact Lithography System PhableR 100

OAI, designers and manufacturers of precision, cost-effective equipment for the Semiconductor MEMS, PV solar energy, nanotechnology and microfluidics today introduced the new non-contact lithography system PhableR 100.

27 Mar 2014

Demand Drives R&D in Micro-Opto-Electro-Mechanical Systems

Commercial demand is driving high-tech research and development in micro-opto-electro-mechanical systems (MOEMS) for diverse applications such as space exploration, wireless systems, and healthcare. A new special section on Emerging MOEMS Technology and Applications in the current issue of the Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3) gathers recent breakthrough achievements and explains how such innovations in the photonics field are poised to emerge in the marketplace. The journal is published by SPIE, the international society for optics and photonics.

26 Mar 2014

Marvell Introduces 88X3240P Ethernet Transceiver Manufactured Using 28nm Lithography

Marvell today announced the Marvell® Alaska® X 88X3240P quad-port Ethernet PHY, designed to bring the benefits of IEEE 10GBASE-T standard to a host of equipment types, ranging from data center and enterprise switches to storage and server equipment.

19 Mar 2014

EV Group China to Serve as Regional Headquarters for EVG's Operations in China

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has opened a new, wholly owned subsidiary in Shanghai, called EV Group China Ltd., which will serve as regional headquarters for all of EVG's operations in the People's Republic of China.

From EV Group 18 Mar 2014

EVG’s NanoSpray Technology Now Available on EVG150XT Resist Coating and Developing System

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its patented NanoSpray conformal coating technology is now available on its newly introduced EVG150XT resist coating and developing system for high-volume manufacturing (HVM) semiconductor applications.

From EV Group 13 Mar 2014

Nanolithography-Based Biomolecular Tweezers Enable Studying Impact of Mechanical Force on Cells

A new type of biomolecular tweezers could help researchers study how mechanical forces affect the biochemical activity of cells and proteins. The devices – too small to see without a microscope – use opposing magnetic and electrophoretic forces to precisely stretch the cells and molecules, holding them in position so that the activity of receptors and other biochemical activity can be studied.

From Georgia Institute of Technology 11 Mar 2014

New Projection Scanner Platform for Advanced Packaging from SUSS MicroTec

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the DSC300 Gen2 projection scanner today. SUSS MicroTec's DSC300 platform for wafer sizes up to 300 mm is based on the projection lithography technology developed by SUSS MicroTec Photonic Systems Inc. (formerly Tamarack Scientific).

From SUSS MicroTec AG 5 Mar 2014

New DSA Lithography Techniques May Help Decrease Cost of Manufacturing Semiconductors

MIT researchers sponsored by Semiconductor Research Corporation (SRC), the world’s leading university-research consortium for semiconductors and related technologies, have introduced new directed self-assembly (DSA) techniques that promise to help semiconductor manufacturers develop more advanced and less expensive components.

From Massachusetts Institute of Technology 27 Feb 2014

Nanolithography News

Research and Markets Adds Report on Global Atomic Layer Deposition Market 2014 - 2018

New Mask Aligner MA200 Gen3 Tool for High Volume Manufacturing Launched by SÜSS MicroTec

OAI Unveils New Non-Contact Lithography System PhableR 100

Demand Drives R&D in Micro-Opto-Electro-Mechanical Systems

Marvell Introduces 88X3240P Ethernet Transceiver Manufactured Using 28nm Lithography

EV Group China to Serve as Regional Headquarters for EVG's Operations in China

EVG’s NanoSpray Technology Now Available on EVG150XT Resist Coating and Developing System

Nanolithography-Based Biomolecular Tweezers Enable Studying Impact of Mechanical Force on Cells

New Projection Scanner Platform for Advanced Packaging from SUSS MicroTec

New DSA Lithography Techniques May Help Decrease Cost of Manufacturing Semiconductors

New Approach to Flawless Nanocellular Graphene

Engineered 3D Hydrogel Addresses Microplastic Contamination in Water

Scalable Technique Enables Mass Production of TMT Nanosheets

Application of Nanoparticles in Cancer Treatment

Advancing Quantum Technologies with Magnetic “Butterfly”

Applying AI-Driven Solutions to Semiconductor Digital Design

Redux AFM: Expanding Access to Automated Nanoscale Imaging

Project Pursues Ultra Low-Cost, Flexible Perovskite Solar Cells

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