Applied Materials today announced the Applied Centura® Tetra(TM) Z Photomask Etch system for etching next-generation optical lithographic photomasks needed by the industry to continue multiple patterning scaling to the 10nm node and beyond. The new tool extends the capabilities of Applied's industry-leading Tetra platform, delivering angstrom-level photomask accuracy for critical dimension (CD) parameters required to meet stringent patterning specifications for future logic and memory devices.
Governor Andrew M. Cuomo today announced the installation of the world’s first ever 450mm Immersion Scanner has begun at the SUNY Polytechnic Institute's Albany NanoTech Complex. Developed by Nikon Corporation, this first of its kind tool will accelerate the development of the next generation computer chips used in a variety of consumer and commercial applications.
Experience the newest developments in semiconductor test solutions, nanotechnology products and terahertz systems by visiting leading semiconductor test equipment supplier Advantest Corporation's exhibit at SEMICON Southeast Asia. The exposition takes place April 22-24, 2015, at the SPICE Arena in Penang, Malaysia.
Water is the key component in a Rice University process to reliably create patterns of metallic and semiconducting wires less than 10 nanometers wide.
Rudolph Technologies, Inc. announced today that a major outsourced assembly and test (OSAT) manufacturer has selected the JetStep® Advanced Packaging Lithography System for evaluation. The tool, which ships this week, will be used to develop copper (Cu) pillar bumping and through silicon via (TSV) processes used in the development of next-generation flip chip technology.
Organic light emitting diodes (OLEDs), which are made from carbon-containing materials, have the potential to revolutionize future display technologies, making low-power displays so thin they'll wrap or fold around other structures, for instance.
SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, has received a large order for various lithography tools from TDK in Q4 2014. Delivery and installation will take place already in the first quarter 2015.
As a testament to Governor Andrew M. Cuomo’s high-tech blueprint for New York State, SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE) announced that it is once again playing a major role at SPIE Advanced Lithography, a leading lithography-focused forum, with forty technical papers by SUNY Poly CNSE faculty, staff, and students and its corporate partners accepted for presentation.
Canon U.S.A. Inc., a leader in digital imaging solutions, today announced that its parent company, Canon Inc., is developing a next-generation semiconductor lithography system employing nanoimprint technology that makes possible sub-20 nm1 high-resolution processes.
Mycronic AB (publ), has received order for two FPS mask writers from an existing customer in Asia. Delivery is scheduled during the second half of 2016 at the latest.