May 22 2015
The new ZEISS MeRiT neXT mask repair tool hosts the innovative ZEISS low energy ebeam column, which enables the repair of smallest possible clear and opaque defects with the highest accuracy. The low energy beam increases the process resolution and simultaneously reduces side effects.
The redeveloped chemical toolbox allows a massively enhanced selectivity and addresses more blank types including EUV and high durable Phase Shifting Masks (HD PSM). The ZEISS MeRiT neXT introduces a novel Rapid Probe Microscope (RPM), a new type of AFM, which operates at SEM speed level. The RPM enables applications like repair verification, 3D feature analysis and repair of Chromeless Phase Shifting Lithography (CPL) as well as buried multilayer defects on EUV masks.
“The new ZEISS MeRiT neXT is a paradigm shift in classical mask repair. Low energetic electrons finally enable the repair of smallest defects through straight local interaction with no collateral damage and an outstanding imaging quality at the same time.” states Dr. Markus Waiblinger, Product Manager of ZEISS MeRiT neXT.
The low energy-beam mask repair system ZEISS MeRiT neXT provides the mask manufacturer with an ultra-high precision repair solution for every type of photomask. It enables production at high-end facilities to meet the requirements of current and upcoming technology nodes.
Source: http://www.zeiss.com/