Nanolithography News

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Major OSAT Manufacturer Selects Rudolph JetStep® Advanced Packaging Lithography System for Evaluation

Rudolph Technologies, Inc. announced today that a major outsourced assembly and test (OSAT) manufacturer has selected the JetStep® Advanced Packaging Lithography System for evaluation. The tool, which ships this week, will be used to develop copper (Cu) pillar bumping and through silicon via (TSV) processes used in the development of next-generation flip chip technology.

From Rudolph Technologies 12 Mar 2015

Confining Charge Transport and Recombination to Nanoscale Areas Increases Efficiency of OLEDs

Organic light emitting diodes (OLEDs), which are made from carbon-containing materials, have the potential to revolutionize future display technologies, making low-power displays so thin they'll wrap or fold around other structures, for instance.

3 Mar 2015

SUSS MicroTec Receives Large Lithography Tools Order from TDK

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, has received a large order for various lithography tools from TDK in Q4 2014. Delivery and installation will take place already in the first quarter 2015.

From SUSS MicroTec AG 28 Feb 2015

SUNY Poly CNSE Recognized at SPIE Advanced Lithography 2015 for Pioneering Lithography Research

As a testament to Governor Andrew M. Cuomo’s high-tech blueprint for New York State, SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE) announced that it is once again playing a major role at SPIE Advanced Lithography, a leading lithography-focused forum, with forty technical papers by SUNY Poly CNSE faculty, staff, and students and its corporate partners accepted for presentation.

From College of Nanoscale Science and Engineering, University at Albany 25 Feb 2015

Canon Announces Development of Next-Generation Nanoimprint Semiconductor Production System

Canon U.S.A. Inc., a leader in digital imaging solutions, today announced that its parent company, Canon Inc., is developing a next-generation semiconductor lithography system employing nanoimprint technology that makes possible sub-20 nm1 high-resolution processes.

24 Feb 2015

Asian Customer Places Order for Two Mycronic FPS Mask Writers

Mycronic AB (publ), has received order for two FPS mask writers from an existing customer in Asia. Delivery is scheduled during the second half of 2016 at the latest.

19 Feb 2015

The University of Manchester Uses Oxford Instruments Tools for Ground Breaking Graphene Research

Ground breaking research into graphene and other 2D materials will take place at The University of Manchester’s new National Graphene Institute using multiple, recently purchased, plasma etch and deposition systems from Oxford Instruments.

From Oxford Instruments Plasma Technology 12 Feb 2015

Toshiba and SK hynix Enter Agreement to Jointly Develop Nano Imprint Lithography

Toshiba today announced that it has entered into a definitive agreement with SK hynix on joint development of Nano Imprint Lithography (NIL). Engineers from the two companies will start development of basic technologies for the process at Toshiba’s Yokohama Complex in Yokohama, Japan in April this year, targeting practical use in 2017. Today’s announcement builds on an MOU that the companies signed in December last year.

6 Feb 2015

Leading OSAT Facility Acquires Rudolph JetStep® Advanced Packaging Lithography System

Rudolph Technologies, Inc. announced today that it has shipped the JetStep® Advanced Packaging Lithography System to a leading outsourced assembly and test (OSAT) facility. This new customer will use the JetStep W Series for fan-out wafer level packaging (FO-WLP) applications.

From Rudolph Technologies 3 Feb 2015

Bristol Awarded £450,000 to Develop GaN Nano-Engineered Semiconductors

The Universities of Bath, Bristol, Sheffield and Strathclyde and their industrial partners have been given funding to develop the UK into a future hub for the manufacture of advanced semiconductor materials.

23 Dec 2014

Nanolithography News

Major OSAT Manufacturer Selects Rudolph JetStep® Advanced Packaging Lithography System for Evaluation

Confining Charge Transport and Recombination to Nanoscale Areas Increases Efficiency of OLEDs

SUSS MicroTec Receives Large Lithography Tools Order from TDK

SUNY Poly CNSE Recognized at SPIE Advanced Lithography 2015 for Pioneering Lithography Research

Canon Announces Development of Next-Generation Nanoimprint Semiconductor Production System

Asian Customer Places Order for Two Mycronic FPS Mask Writers

The University of Manchester Uses Oxford Instruments Tools for Ground Breaking Graphene Research

Toshiba and SK hynix Enter Agreement to Jointly Develop Nano Imprint Lithography

Leading OSAT Facility Acquires Rudolph JetStep® Advanced Packaging Lithography System

Bristol Awarded £450,000 to Develop GaN Nano-Engineered Semiconductors

Engineered 3D Hydrogel Addresses Microplastic Contamination in Water

New Approach to Flawless Nanocellular Graphene

Custom Nanoparticles That Can Transport Drugs to the Heart

New 2D Polymers Bridge the Gap in Electron Mobility for Organic Semiconductors

Advancing Quantum Technologies with Magnetic “Butterfly”

Applying AI-Driven Solutions to Semiconductor Digital Design

Redux AFM: Expanding Access to Automated Nanoscale Imaging

Project Pursues Ultra Low-Cost, Flexible Perovskite Solar Cells

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