Invenios, an advanced technology micro-fabrication foundry specializing in microfluidics, MEMS, and 3D microstructures announced the addition of silicon and metal substrates to the range of materials utilizing the firm's innovative Ambient Temperature Bonding (ABT) micro-system production process for the permanent bonding of substrates, such as silicon-to-glass, metal-to-glass, and glass-to-glass at room temperatures without the use of electrostatics, heat or adhesives.
Research and Markets has announced the addition of the "Executive Summary of the Status of the MEMS Industry" report to their offering.
InvenSense, Inc., the leading provider of MotionTracking™ system on chip (SoC) and Sound devices, introduces the ICM-20728, the world’s first integrated 7-axis (3-axis gyroscope + 3-axis accelerometer + pressure sensor) single chip platform solution with onboard Digital Motion Processor (DMP™).
IEEE, the world’s largest professional organization dedicated to advancing technology for humanity, announced that the IEEE Standards Association (IEEE-SA) and MEMS Industry Group (MIG), the trade association advancing micro-electromechanical systems across global markets, have signed a memorandum of understanding (MOU) to help accelerate and broaden the adoption of globally relevant standards-based technologies for eHealth and the Internet of Things (IoT).
Research and Markets has announced the addition of the "Global MEMS Gyroscope Market Report to 2016" report to their offering.
Research and Markets has announced the addition of the "Thin Film PZT for Semiconductor Application Trends & Technology Update Report" report to their offering.
Presto Engineering, Inc., a world leader in semiconductor back-end turnkey production services, and DelfMEMS, a leading provider of MEMS devices for mobile applications, announced today that they have worked together to design, from specification to integration, the first full PXI-based test system for ultra-fast characterization testing of radio frequency (RF) micro-electro-mechanical-systems (MEMS).
Murata Manufacturing Co., Ltd. (hereinafter "Murata") has developed newly capacitive type MEMS pressure (barometer) sensor (2.3 x 2.6 mm typ.). Samples and pre-production quantities will be delivered to customers in early 2014, with mass production ramping up to support broad market demand by Q4.
MEMS Industry Group (MIG) will host its third annual MEMS Executive Congress® Europe, 11 March, 2014 in Munich, Germany. This European edition of MIG's highly successful executive event features an opening presentation by MIG Executive Director Karen Lightman and keynotes by X-FAB Group CEO Rudi de Winter and Robert Bosch President of Automotive Electronics Klaus Meder.
Research and Markets has announced the addition of Dedalus Consulting Inc's new report "MEMS Oscillators - Global Markets, Technologies & Competitors: 2012-2018 Analysis & Forecasts" to their offering.
Terms
While we only use edited and approved content for Azthena
answers, it may on occasions provide incorrect responses.
Please confirm any data provided with the related suppliers or
authors. We do not provide medical advice, if you search for
medical information you must always consult a medical
professional before acting on any information provided.
Your questions, but not your email details will be shared with
OpenAI and retained for 30 days in accordance with their
privacy principles.
Please do not ask questions that use sensitive or confidential
information.
Read the full Terms & Conditions.