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SMIC Adopts Cadence Solutions to Predict Stress and Lithographic Variability on Performance of 65- and 45-nm Semiconductor Designs

SMIC Adopts Cadence Solutions to Predict Stress and Lithographic Variability on Performance of 65- and 45-nm Semiconductor Designs

From Cadence Design Systems 19 Oct 2009
Results Prove SOI-Based Planar CMOS Meets Requirements for Low-Power, 22nm Node Devices

Results Prove SOI-Based Planar CMOS Meets Requirements for Low-Power, 22nm Node Devices

16 Oct 2009

Samsung's Latest Chip Innovation Combines RF and Digital Chip Components into Single 65 nm Chip

16 Oct 2009
Mentor Graphics Enters into Multi-Year Software and Services Agreement with GLOBALFOUNDRIES

Mentor Graphics Enters into Multi-Year Software and Services Agreement with GLOBALFOUNDRIES

From GlobalFoundries 16 Oct 2009
AppliedMicro Announces First Member of APM 83K Series System on Chip Family

AppliedMicro Announces First Member of APM 83K Series System on Chip Family

16 Oct 2009

TSMC and SVTC Forms Innovation Incubation Alliance

From TSMC Taiwan Semiconductor Manufacturing Company 15 Oct 2009
Applied Materials and Taiwan's ITRI to Accelerate Development of 3D Chip Stacking Technology

Applied Materials and Taiwan's ITRI to Accelerate Development of 3D Chip Stacking Technology

From Applied Materials Inc. 15 Oct 2009
SMIC Extends 45-nm Bulk CMOS Technologies to 40nm and 55nm Geometries

SMIC Extends 45-nm Bulk CMOS Technologies to 40nm and 55nm Geometries

From Semiconductor Manufacturing International Corporation (SMIC) 14 Oct 2009

Fujitsu Microelectronics Selects Cadence Advanced Verification Solution

From Cadence Design Systems 14 Oct 2009
Single-Molecule Diode Opens New Gateway in Electronics

Single-Molecule Diode Opens New Gateway in Electronics

14 Oct 2009

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