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STMicroelectronics Adopts Complete Cadence Integrated Signoff Solutions for 65- and 45-Nanometer Design

Companies Combine Low-Power Processor Architecture, Integrated Design Flow and System-Level IP on Common Platform Foundry Process

IBM Fellow Recognized for Outstanding Contribution to the Field of Magnetism

IBM Fellow Recognized for Outstanding Contribution to the Field of Magnetism

Researchers Press on in Their Mission to Power Nanodevices of Tomorrow

New Bottom-Up Hierarchical and Hotspot Fixing Flows Improve Performance, Power and DFM

New Bottom-Up Hierarchical and Hotspot Fixing Flows Improve Performance, Power and DFM

ARM and Cadence Collaborate to Enable New Generation of Physical IP for IBM 45nm SOI Process

Strasbaugh Receives Multi-Million Dollar Order for its New STB P300 CMP System.

A Step Toward Lithium Fuel Cell Using Recyclable Lithium

A Step Toward Lithium Fuel Cell Using Recyclable Lithium

SMIC Announces Successful Commercial Production of 130nm Family of DisplayLink USB Graphics Chips

SMIC Announces Successful Commercial Production of 130nm Family of DisplayLink USB Graphics Chips

Industry's Fastest ARM Cortex-A8 Processor Based Mobile Core in 45 nm Low Power Process

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