Nemotek Technologie, a manufacturer of customized Wafer-Level Cameras for portable applications, today announced a partnership with electronic component distributor Anglia to open a logistics center in Hong Kong. The new center will provide Nemotek Technologie's customized Wafer-Level Packaging (WLP) and Wafer-Level Optics (WLO) solutions to approved customers in Asia.
Recognizing new opportunities to provide innovative solutions such as customized WLP and WLO to the Asian market, the Hong Kong-based logistics center demonstrates Nemotek Technologie's commitment to respond to customer needs and deliver high quality, low defect wafer-level solutions. The new logistics center will enable the company to work more closely with image sensor and other device manufacturers of portable applications in Asia. With operations already in Korea, Japan, Taiwan and China, the logistics center further expands the company's regional activities.
“Nemotek Technologie's wafer-level solutions are a great addition to our electronic component offerings in Asia,” said Jim Ward, sales and marketing director for Anglia. “Whether their products are used for optics or packaging of image sensors, Nemotek exhibits industry leadership and we are excited for this new opportunity to work together to address our customer needs.”
Industry tested and qualified, Nemotek Technologie's WLO and WLP solutions are based on reflow compatible materials, allowing for increased customization and flexibility while maintaining a small form factor. Bypassing configured design rules, the WLO and WLP solutions are mounted directly to application assembly boards, utilizing fewer components and resulting in more cost savings for customers.
“Expanding our presence in Asia allows us to reach our customers more efficiently, with assembled products available sooner based on a more streamlined manufacturing and distribution process,” said Jacky Perdrigeat, CEO of Nemotek Technologie. “Anglia will be a great partner for us based on their expertise and established relationships. We look forward to many opportunities to deliver advanced wafer-level solutions in Asia.”