LORD Corporation - a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics, LED and solar industries - has announced that Andrew Kintz, Manager, Open Technology Innovation, and Candice Brannen, Senior Scientist, will present white papers at the 43rd International Symposium on Microelectronics.
The Symposium is being sponsored by the International Microelectronics and Packaging Society (IMAPS). Held at the Raleigh Convention Center in Raleigh, N.C. on October 31, the conference will address four tiers of electronics: Industry; Systems and Applications; Design; and Materials and Process. The IMAPS Technical Committee seeks original papers that present progress on technologies "between the chip and the system."
Kintz will discuss high brightness LEDs and their challenge with thermal management issues, due to increased power and reduced surface area. He will cover innovative technology from LORD Corporation's "no-pump out" thermal greases and low modulus adhesives. Kintz has more than 20 years of broad-based industrial experience in job functions ranging from research and development to operations management. He has worked globally on LORD Corporation's business for rubber-to-metal and structural adhesives. His work on Magnetic Rheological (MR) fluids led to the use of MR devices in production vehicles in the automotive industry. Kintz holds numerous U.S. and international patents, with more than 10 patents for his work relating to Polymer Chemistry and Magnetic Rheological Fluids.
Brannen will address wafer-level chip scale packages (WLCSP). Her white paper will discuss the reliability improvements to 400um pitch WLCSP assemblies. Brannen has been with LORD Corporation for two and a half years as a product development chemist in the area of Wafer Level Packaging.