Thin Film Electronics and PARC have entered the second phase of their collaboration to develop samples of printed memory products prior to mass-production.
According to the agreement, Thin Film will deploy the PARC CMOS technology to enhance the memory used in its roll-to-roll printed manufacture process. Products featuring Thin Film addressable memory will allow PARC to use its technology. This development will create cost -effective form factors to be incorporated into other printed parts such as sensors and displays for use in multiple industrial segments such as games, toys, ID tags, disposable sensors, and price tags.
Ana Arias, co-chief of Thin Film’s Technology Council, U.C. Berkeley Associate Professor in EECS, remarked that the recent development will enable printed electronics suppliers to develop systems featuring multiple benefits. Both companies were represented at the Printed Electronics Europe conference held recently in Dusseldorf, Germany.
PARC showcased its products and technologies Dr. Ross Bringans, vice president of the company’s Electronic Materials and Devices research, described the developments in the industry and how new collaborations are driving companies to move from memory conceptualization to action production.
Thin Film also introduced its portfolio at the conference, where Davor Sutija, chief executive office of Thin Film mentioned about his company’s strategy that has progressed from stand-alone memories to integrated platforms. He announced that his company has become a product company and has already released the Memory Controller, Toy Development Kit and the technology demonstrator game OBA.