Posted in | Nanoelectronics

3M Opens Laboratory for Temporary Bonding and De-Bonding of Ultra-Thin Wafers

3M has opened an application laboratory in Yangmei, Taiwan, for temporary wafer bonding of 200 and 300 mm wafers. The 3M semiconductor innovation center provides its customers in Taiwan and all over Asia with 3M’s wafer support system (WSS) techniques and materials for temporary bonding of ultra-thin wafer used in 3D integrated circuit (IC) packaging.

In the 3D packaging process, temporary bonding is essential to bond the wafers temporarily during the production process and then to safely de-bond them without causing any damage.

Future 3D packages have a shrinking form factor, high demand for power management, and complicated packaging techniques. Therefore, they require a novel material and process to overcome many technical challenges such as temporary ultra-thin wafer bonding to pack silicon devices that have enhanced performance levels.

The 3M WSS has systems and materials that render temporary bonding to enhance wafer thinning and continuous processing of ultra-thin wafers used in 3D packaging. 3M’s liquid UV-curable adhesives provide firm bonding and support to thinned wafers during the severe grinding and continuous high-temperature processing. The 3M adhesive and glass system helps in obtaining an ultra-thin wafer with good thermal and electrical properties.

Once the processing cycles are completed, 3M’s in-built light-to-heat conversion (LTHC) coating directly permits de-bonding of these thinned wafers to a tape carrier at room temperature and due to continuous support during the complete process stress, warpage, and process complication is considerably reduced. This prevents the wafers from getting damaged resulting in increased yield. 3M’s processes and materials increase production volume at different semiconductor centers.

Source: http://www.3M.com

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