Research and Markets now offers a new report titled ‘Wafer Packaging Fab Database’ that discusses the global overview of the installed capacities and activities of wafer level packaging in more than 250 mid-end factories.
According to the database, there is a high demand to fulfill the requirement of wafer level packaging. Established technologies in wafer level packaging are wafer level chip scale package and flip-chip wafer bumping platforms. However, the emergence of new technologies such as TSV for 3D WLP, 3DIC, 2.5D interposers or FO WLP need more capacities and capabilities for wafer level packaging.
The database covers the extensive list of various locations and key companies working on wafer level packaging. The unique tool provides data for fabless and fab-light semiconductor companies to determine their new sourcing prospects and for equipment and materials suppliers to grow their global business. The innovative tool analyzes WLP technologies distribution by means of business model, country, technology type, companies, investment and growth assessment.
The database includes a list of small research & development and prototype lines and over 20 graphs to know the global trends in a better way. The report covers the mid-end capabilities and wafer level packaging technologies such as TSV, passivation, RDL and bumping, of nearly 250+ fab locations. It offers an extensive list of more than 150 companies operating as bumping house, packaging house, OSAT, IDMs, R&D laboratory, MEMS, foundries, and more.
Source: http://www.researchandmarkets.com