SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, successfully hosted its second Asia Technology Forum in November 2013.
High level speakers from industry and research institutes attended the event. The participants could follow discussions and presentations on new developments in Advanced Packaging, materials and market trends in 3D IC. The event took place on three separate dates at three main Asian industry centers, in Hsinchu (Taiwan) and Shanghai (China) and for the first time in Seoul (South Korea).
The key topics for the industry 3D Integration and Laser Processing for Advanced Packaging/Wafer Level Packaging applications were presented. During the event intense networking with sharing of experience and views took place.
'We initiated the Asia Technology Forum last year with the intention to give our customers and cooperation partners more insight into process developments, current challenges and solutions in the semiconductor industry.', says Frank P. Averdung, President and CEO of SUSS MicroTec 'The Forum was an outstanding success, which is also highlighted by the increased number of attendees compared to last year.'
The Forum featured representatives from the Industrial Technology Research Institute (ITRI), the Shanghai Institute of Microsystem and Information Technology, Amkor Technology, SPIL, DOW Electronic Materials, AZ Electronic Materials, Fraunhofer IZM Berlin, Peking University, Kangnam University, LORD Corporation, Yole Développement, Coherent, Alchimer, SET, GenISys and Brewer Science.