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nGimat Awarded SBIR to Develop Electrode Nanomaterials for Lithium-Ion Batteries

The US Department of Energy (DOE) has awarded nGimat a Small Business Innovation Research (SBIR) Phase I to develop electrode nanomaterials for high-performance Lithium-ion batteries that will be used to power the next g...

16 Jul 2008

Findings Demonstrate Superior Efficacy of Nanoparticle-Based MR Diagnostic Technology

T2 Biosystems, Inc., a company developing the first portable medical diagnostic products which combine nanotechnology and miniaturized magnetic resonance (MR) technology, today announced significant research findings tha...

16 Jul 2008

New Investments Accelerate NY State's International Leadership in Nanotechnology Reasearch and Development

Governor David A. Paterson today announced significant new investments by IBM and New York State, accelerating New York State's international leadership in nanotechnology research and development and creating up to 1...

16 Jul 2008

Providing High Reliability Microelectronic Packaging and Manufacturing Solutions

Neah Power Systems, Inc., a leading developer of fuel cells for military, industrial and consumer portable electronic devices, announced today that it has an ongoing strategic relationship with Aspen Technologies to utilize their high-reliability semiconductor packaging expertise in commercializing its silicon based fuel cell systems. Aspen Technologies is a world-class advanced-packaging service provider enabling its customers to rapidly bring new products to market through the creative application of advanced microelectronic package and assembly technologies, innovative engineering, and scalable manufacturing solutions.

16 Jul 2008

Phantoms Foundation to Coordinate Nanoscale ICT Devices and Systems Coordination Action

The Phantoms Foundation (Spain) has been chosen to coordinate the "Nanoscale ICT Devices and Systems Coordination Action" funded under the Seventh EU Framework Programme. This project aims to reinforce and s...

16 Jul 2008

Collaboration Lowers Development Time and Cost Through Accurate Process Modeling

Mattson Technology, Inc., a leading supplier of advanced semiconductor process equipment used to manufacture integrated circuits (ICs), and Synopsys, Inc., a world leader in software and IP for semiconductor design and m...

16 Jul 2008

Producing Hydrogen Using Water, Solar Energy and Nanotube Diodes

A greener, less expensive method to produce hydrogen for fuel may eventually be possible with the help of water, solar energy and nanotube diodes that use the entire spectrum of the sun's energy, according to Penn St...

16 Jul 2008

Bright Idea Uses Big Science in Nano-Small Packages

The latest bright idea in energy-efficient lighting for homes and offices uses big science in nano-small packages to dim the future Edison's light bulb.

16 Jul 2008

Versatile Platform Offers Multiple Metrology Capabilities in a Single Tool

Nanometrics Incorporated, a leading supplier of advanced process control metrology equipment, today announced the launch of its new Lynx(TM) metrology platform at SEMICON West 2008. The Lynx is the industry's fir...

16 Jul 2008

FEI Connectivity Solutions Reduce Wafers-to-Atoms Time From Days to Hours

FEI Company, a leading provider of atomic-scale imaging and analysis systems, today announced the Ultimate Throughput™ and Ultimate Imaging™ Connectivity Solutions. By accelerating and improving the quality o...

15 Jul 2008

eHARP system Extending Proven Gap-Fill Technology for Critical STI Device Structures to 32nm and Beyond

The eHARP process delivers void-free films to fill <30nm, >12:1 aspect ratio features - essential requirements for the fabrication of advanced memory and logic devices. Featuring proprietary new process innovations, the eHARP system's robust, high-density, strain-inducing films enable the scaling of conventional planar and emerging 3-D device structures.

15 Jul 2008

Depositing Critical Barrier Films for Copper Interconnects in Sub-55nm Memory Chips

Applied Materials, Inc. today announced its Applied Endura® Extensa(TM) PVD1, the industry's only production-worthy system for depositing the critical barrier films for copper interconnects in sub-55nm memory chips.

15 Jul 2008

SUSS MicroTec Unveils Second Generation MA300 Production Mask Aligner at Semicon West 2008

At Semicon West 2008, SUSS MicroTec unveils the second generation of its MA300 Production Mask Aligner featuring a dedicated alignment kit for creating 3D interconnects for applications like chip stacking and 3D image sensor packaging. High alignment accuracy is required to enable 3D applications ranging from latest-generation mobile consumer electronics to supercomputers.

15 Jul 2008

Industry’s First Lithography System for High Volume Manufacturing at 38nm

ASML Holding NV (ASML) announces today its newest TWINSCANTM XT:1950i lithography system using a 1.35 NA lens – increasing the performance of its immersion lithography systems by 25%. The system offers improved ove...

15 Jul 2008

2,700 Hours of Continuous Operation with a Mobion Laboratory Cell

MTI MicroFuel Cells Inc., the developer of Mobion off-the-grid portable power solutions and a subsidiary of Mechanical Technology, Incorporated, announced that it has achieved 2,700 hours of continuous operation with a Mobion laboratory cell - the building block of the Company's Mobion chip and systems.

15 Jul 2008

Nanotechnology News

nGimat Awarded SBIR to Develop Electrode Nanomaterials for Lithium-Ion Batteries

Findings Demonstrate Superior Efficacy of Nanoparticle-Based MR Diagnostic Technology

New Investments Accelerate NY State's International Leadership in Nanotechnology Reasearch and Development

Providing High Reliability Microelectronic Packaging and Manufacturing Solutions

Phantoms Foundation to Coordinate Nanoscale ICT Devices and Systems Coordination Action

Collaboration Lowers Development Time and Cost Through Accurate Process Modeling

Producing Hydrogen Using Water, Solar Energy and Nanotube Diodes

Bright Idea Uses Big Science in Nano-Small Packages

Versatile Platform Offers Multiple Metrology Capabilities in a Single Tool

FEI Connectivity Solutions Reduce Wafers-to-Atoms Time From Days to Hours

eHARP system Extending Proven Gap-Fill Technology for Critical STI Device Structures to 32nm and Beyond

Depositing Critical Barrier Films for Copper Interconnects in Sub-55nm Memory Chips

SUSS MicroTec Unveils Second Generation MA300 Production Mask Aligner at Semicon West 2008

Industry’s First Lithography System for High Volume Manufacturing at 38nm

2,700 Hours of Continuous Operation with a Mobion Laboratory Cell

News Categories

New Approach to Flawless Nanocellular Graphene

Engineered 3D Hydrogel Addresses Microplastic Contamination in Water

Scalable Technique Enables Mass Production of TMT Nanosheets

Application of Nanoparticles in Cancer Treatment

Elusive 3D Printed Nanoparticles Could Lead to New Shapeshifting Materials

Applying AI-Driven Solutions to Semiconductor Digital Design

Redux AFM: Expanding Access to Automated Nanoscale Imaging

Project Pursues Ultra Low-Cost, Flexible Perovskite Solar Cells

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Elevating Heating Systems: Graphene's Breakthrough in Energy Efficiency

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The Nanonspinning Technology Behind Breathable Fabrics