Researchers from Georgia Tech, University of Wisconsin-Madison, Oak Ridge National Laboratory, Arizona State University and Xiamen University in China have developed a new fabrication method that minimizes the need for expensive metal to induce catalytic activity in fuel cell applications.
University of Wisconsin-Madison engineers have developed a new approach to structuring the catalysts used in essential reactions in the chemical and energy fields. The advance offers a pathway for industries to wean themselves off of platinum, one of the scarcest metals in the earth's crust.
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the release of two new series of Advanced Low Power SRAM (Advanced LP SRAM), the leading type of low-power-consumption SRAM, designed to provide enhanced reliability and longer backup battery life for applications such as factory automation (FA), industrial equipment, and the smart grid.
ProPlus Design Solutions, Inc. today announced that eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, has selected its high-performance parallel SPICE simulator and its variation analysis platform for advanced intellectual property (IP) designs at 28-nanometer (nm), 16nm and beyond.
Xilinx, Inc. today announced Vivado® Design Suite early access support for the 16nm UltraScale+™ portfolio, including Zynq® UltraScale+ and Kintex® UltraScale+ devices. The Vivado early access release has been co-optimized with the UltraScale+ ASIC-class programmable logic to exploit the full advantages of production UltraScale+ devices, leveraging the complete catalog of SmartCORE™ and LogiCORE™ IP.
II]VI Incorporated ] II]VI Advanced Materials, a world leading supplier of single crystal SiC (silicon carbide) substrates and CVD]grown polycrystalline diamond materials, recently exhibited the worldfs first 200mm diameter SiC wafer at the 2015 Compound Semiconductor Manufacturing Technology (CS MANTECH) conference in Scottsdale, AZ and the International SiC Power Electronics Applications Workshop (ISiCPEAW) in Stockholm, Sweden.
Entegris, Inc., a leader in yield-enhancing materials and solutions announced today the release of Torrento® X Series 7 nm filters with FlowPlane™ linear filtration technology. FlowPlane is the semiconductor industry's first scalable, linear, high-flow filtration platform enabling advanced wet cleaning applications for the 10 nm node and beyond. The first in a series of filters based on the linear filtration technology, the FlowPlane S model is designed for point of dispense (POD) applications, enabling improvements in both on-wafer defectivity and yield for critical wet cleaning applications.
Nano-electronics research center imec announced today at SEMICON West that it has demonstrated concept and feasibilityfor pore-sealing low-k dielectrics in advanced interconnects. The method, based on the self-assembly of an organic monolayer, paves the way to scaling interconnects beyond N5.
Today, at SEMICON WEST 2015 (San Francisco), world-leading nano-electronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries announced that they have jointly developed an automated thermocompression solution for narrow-pitch die-to-wafer bonding, a method by which singulated dies are stacked onto bottom dies which are still part of a fully intact 300mm wafer. The solution features high accuracy and high throughput, paving the way to a manufacturable 2.5D, 3D, and 2.5D/3D hybrid technology.
CEA-Leti today announced its first results towards the demonstration of CoolCube’s feasibility in FinFET technology on its 300mm production line, and new CoolCubeTM circuit designs that improve the trade off between area, speed and power.
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