CEA/Leti and EV Group to Accelerate Adoption of TSV and 3D Integration Technology

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has entered a joint development program (JDP) with CEA/Leti -- one of Europe's renowned research labs focusing on microelectronics and nanotechnology. EVG, an early leader in through-silicon-via (TSV) and 3D integration technology, will provide CEA/Leti with its world-class, 300-mm temporary bonding and debonding technology. The first system will be shipped in May. The joint development work will focus on further developing these technologies and processes to accelerate continued adoption of TSV technology -- given its demonstrated advantages, which include higher performance, increased functionality, smaller footprint and lower power consumption.

More functionality, lower power

Flash memory and image sensors continue to lead the charge implementing 3D IC/TSV technology due to the complexity of the device structure and demands for more functionality with lower power. In demonstrating a cost-effective, manufacturable stackable interconnection technology, experts project TSV adoption to grow intensively over the next few years expanding into various other advanced IC applications. This joint development program spearheads another critical step to readying integrated device manufacturers and foundries to fully implement 3D integration technology and processes into their production lines, and bringing this technology's advantages to a global commercial scale.

"We are extremely pleased to be working with EVG--not only for their proven bonding/debonding and thin-wafer handling technology systems, but also for the tremendous groundwork and expertise on tools for TSV technology and 3D integration they bring to the table, which complements our own know-how in this field," said Nicolas Sillon, the head of the laboratory for advanced packaging and 3D integration at Leti. "TSV and 3D integration is proving to be a viable solution to a critical roadblock in advanced device performance. Together we can continue to unlock the full potential of this technology to ensure widespread commercialization for high-volume applications."

Successful results

Commenting on today's announcement, Stefan Pargfrieder, EVG's business development manager noted, "CEA/Leti is a world leader in accelerating emerging technologies to widespread market adoption. We are thrilled to be working with such a prestigious institution, and believe their expertise will be crucial to this JDP and pushing TSV and 3D technology forward in the market place. We are seeing an increasing number of high-volume manufacturers exploring implementation of this technology in their production lines, and this joint effort with CEA/Leti will be instrumental in continuing this positive momentum."

This cooperation also strengthens the existing and established joint development activities between Brewer Science, EVG and Leti. Ultimately, it exemplifies the synergy between materials, equipment and process expertise, and further enables value-added products and know-how in the growing field of 3D IC/TSV technology, as well as other potential users of temporary bonding and debonding techniques.

CEA/Leti and EV Group have already commenced work on the project and have produced successful results in 3D applications using their TSV technology and processes.


Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    CEA-Leti. (2019, February 14). CEA/Leti and EV Group to Accelerate Adoption of TSV and 3D Integration Technology. AZoNano. Retrieved on May 24, 2024 from https://www.azonano.com/news.aspx?newsID=10707.

  • MLA

    CEA-Leti. "CEA/Leti and EV Group to Accelerate Adoption of TSV and 3D Integration Technology". AZoNano. 24 May 2024. <https://www.azonano.com/news.aspx?newsID=10707>.

  • Chicago

    CEA-Leti. "CEA/Leti and EV Group to Accelerate Adoption of TSV and 3D Integration Technology". AZoNano. https://www.azonano.com/news.aspx?newsID=10707. (accessed May 24, 2024).

  • Harvard

    CEA-Leti. 2019. CEA/Leti and EV Group to Accelerate Adoption of TSV and 3D Integration Technology. AZoNano, viewed 24 May 2024, https://www.azonano.com/news.aspx?newsID=10707.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.