Inc. today announced that it has expanded its breakthrough AKT- PiVot™
55KV PVD* system to include advanced copper deposition processing for manufacturing
TFT-LCD* flat panel displays (FPD). Using the PiVot system, FPD manufacturers
can transition from aluminum to copper bus lines to achieve faster pixel response
and lower power consumption in next-generation LCD-TV panels. The PiVot system
delivers benchmark, cost-efficient copper deposition performance by combining
high deposition rates, efficient target utilization and long maintenance intervals
with enhanced film morphology.
Key to the PiVot system’s superior film quality is its proprietary rotary
cathode design that employs unique deposition modulation technology to deposit
copper layers with uniform grain distribution, low resistivity and high thickness
uniformity. The PiVot system also enables greater than 80% target utilization
to provide significant savings in expensive target material.
“By providing unmatched film properties and efficient raw material utilization,
our AKT-PiVot system answers the critical needs of today’s LCD TV market
that is driven by demand for larger and ultra-high definition panels and requires
innovations in deposition technology to deliver high-quality films at a low
cost-of-ownership,” said Dr. Mark Pinto, senior vice president and general
manager of Applied’s Display, and Energy and Environmental Solutions groups.
“The system’s proven productivity and proprietary copper process
technology create a powerful addition to our strong portfolio of FPD solutions.”
The PiVot system’s modular architecture enables a large variety of configurations
to maximize production efficiency, eliminating the bottlenecks caused by different
process times in different modules in a traditional in-line machine. The PiVot
system’s cluster-like arrangement also allows continuous operation during
individual module maintenance. Combined with long maintenance intervals and
extended target life, PiVot system provides the highest availability and longest
continuous production time in the industry.
The AKT-PiVot 55KV PVD system’s superior copper deposition technology
will be showcased at Applied Materials’ booth at FPD International and
Green Device 2009 in Yokohama, Japan, on October 28-30 as part of Applied’s
portfolio of advanced FPD manufacturing solutions. These solutions include PECVD*,
PVD for TFT-array and color filter, electron beam array test technologies, factory
automation and service. In addition, Applied Materials will display its green
device manufacturing technologies, including solar, low-e glass coating and
roll-to-roll deposition for flexible PV* and display.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in Nanomanufacturing
Technology™ solutions with a broad portfolio of innovative equipment,
service and software products for the fabrication of semiconductor chips, flat
panel displays, solar photovoltaic cells, flexible electronics and energy
efficient glass. At Applied Materials, we apply Nanomanufacturing Technology
to improve the way people live. Learn more at www.appliedmaterials.com.
* TFT-LCD = thin film transistor liquid crystal display; PVD = physical vapor
deposition; PECVD = plasma-enhanced chemical vapor deposition; PV = photovoltaic