SHELLCASE Wafer-Level Image Sensor Packaging Technology Enables Cost Reductions and Acceleration of Time-To-Market

Tessera Technologies, Inc. (Nasdaq:TSRA) announced today that China-based Jiangyin Changjiang Advanced Packaging Corporation (JCAP) has licensed Tessera's SHELLCASE® MVP image sensor packaging technology. JCAP will use the SHELLCASE MVP technology in its production line for image sensor wafer-level packaging designed for portable products such as mobile phones, notebook and netbook computers, as well as camera products in consumer electronics.

“Tessera's leading-edge SHELLCASE wafer-level packaging technology will help us to be successful in the highly competitive, rapidly evolving global consumer electronics market,” said Lai Chih-Ming, president, JCAP. “Our customers will benefit from this wafer-level chip-scale packaging technology with its stronger electric performance efficiency.”

“As a growing percentage of CMOS image sensors are being manufactured with chip-scale packaging, the cost and form factor benefits of our through silicon via (TSV) wafer-level packaging technology are being recognized by our customers,” said Michael Bereziuk, executive vice president, Imaging & Optics, Tessera. “We are very pleased to have JCAP, a leader in wafer-level processing, to help make this capability available to the camera module supply chain.”

Tessera recorded an initial fee from JCAP under this license agreement in the third quarter of 2009. Because SHELLCASE MVP is ‘infrastructure' intellectual property the timing between signing a SHELLCASE MVP license agreement and Tessera's receipt of initial royalty payments under the agreement is approximately 15-30 months.

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