This unique report addresses the applications and technologies of printing, curing and key integration equipment that is enabling printed electronics.
The report assesses the performance of each printing and curing technology type, providing for each:
- Assessment of capability and suitability to printing different types of materials- Analysis of existing uses of the printing technology in printed electronics- Trends and opportunities for the printing technologies- Leading suppliers and company profiles
This is assessed for the following printing and printed related manufacturing technologies:
- Screen printing- Inkjet printing- Flexo printing (and offset)- Gravure printing (and offset)- Nano imprinting/embossing- Transfer printing- Coating systems (Slot die and alternatives)
The following post-printing processes are also covered, including
- Thermal drying- IR and UV curing- Photonic curing
In addition, we cover companies working on equipment integration, manufacturing centers and government funded printed electronics initiatives and manufacturing centers.
State of market and future application assessment
The report looks at the current deployment of printing technologies by type and by application, summarized as follows:
Each printing type is assessed versus emerging products - covering which materials are suitable to each printing type and the application potential for those printed devices. Often, printing is only part of the complete product, and therefore we address printing electronic or electrical materials by layer type.
89 organizations covered
Progress of 89 organizations are covered, segmented by products they provide, value chain positioning and the market leaders are identified.