New Superfast 4G High-Volume, In-Line, 3D Topography Inspection System from Ultratech

Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today introduced the Superfast 4G high-volume, in-line, 3D topography inspection system.

Ultratech's new 4G system builds on the field-tested capability of the Superfast 3G, providing the industry's highest-productivity and lowest-cost solution compared to competing systems. The Superfast 4G system's patented coherent gradient sensing (CGS) technology provides a high degree of flexibility that enables Ultratech customers to use a single type of wafer inspection tool to measure the front side of patterned wafers across the entire fab line at the lowest cost. Ultratech plans to begin shipping the Superfast 4G systems in the first quarter of 2015.

The Superfast 4G leads the industry:

  • Direct, front-side 3D topography measurement for patterned wafers
  • Highest throughput for in-line, patterned wafer system—125 wph
  • Lowest cost-of-ownership─3x to 5x lower compared to competing systems
  • Flexibility to measure front side of patterned wafers anywhere in the production line, (front-, middle- and back-end-of-line)
  • Open-architecture inspection platform can improve lithography performance
  • Small wafer-shaped inspection footprint significantly reduces customer production costs compared to competing systems

Ultratech Vice President, Marketing Inspection System & Technology Transfer, Shrinivas Shetty explained, "By working with leading-edge memory and logic customers using Ultratech's 3G systems, we were able to successfully implement the industry's requirements for 3D topography with in-line inspection tools. Ultratech invested heavily in the algorithm and factory automation capabilities, expanded manufacturing capacity in Singapore and developed regional senior applications managers to help ensure a smooth ramp to volume production. Ultratech also made significant improvements to the new Superfast 4G inspection system, resulting in increases of 2.5x in performance and 65 percent in throughput, as well as a 30 percent reduction in edge exclusion, compared to the 3G system. Moreover, the two inspection systems have identical process modules retaining all critical optical components ensuring a smooth transition from the 3G to the 4G system for high-volume production. The Superfast 4G is an example of Ultratech's commitment to providing leading technology that cost-effectively addresses the critical needs of its global customers for high-volume manufacturing."

Ultratech's Superfast 4G Inspection System

Based on patented coherent gradient sensing (CGS) technology, Ultratech's Superfast 4G inspection system for patterned wafers provides the industry's highest throughput (125 wph), with the lowest cost-of-ownership (3x to 5x lower) compared to competing systems. The direct, front-side 3D topography measurement capability is well suited for patterned wafer applications such as feed-forward overlay distortion control, 3D topography measurement for focus control, and high-stress process control (bow, warpage, breakage). The Ultratech Superfast 4G inspection system provides leading technology to address the critical needs of its global customers in a cost-effective solution.

Source: http://www.ultratech.com/

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