Jordan Valley announces the selection of their advanced JVX7300RF-W, by a world leading process equipment manufacturer. The tool was selected following extensive evaluation of tool capability, performance and productivity for development and customers' demonstration of advanced wafer level packaging and thin-film applications.
Jordan Valley, a leading supplier of X-ray based in-line metrology systems for advanced semiconductor manufacturers, today announced that it received an order from a market-leading equipment manufacturer, selecting the new JVX7300RF-W metrology system for advanced process development and control.
The JVX7300RF-W system offers invaluable in-line metrology combining both small spot XRF and first principle XRR and providing solutions for multilayer complex 2D and 3D metal stacks, as well as ultra-thin layers (<10Å) and small pads or micro-bumps.
The JVX7300RF-W delivers high ROI and low CoO for its inline metrology of next generation Wafer Level Packaging (WLP) advanced micro-bump process development and control, allowing high throughput non-destructive thickness and composition measurements.
JVX7300RF-W is the successor to the production proven JVX6200iRF with extended capabilities and significant productivity improvements. The 7300RF-W allows metrology on smaller features necessary to adhere to the industry roadmaps and the WLP segment's unique needs among others.
"This order marks the true need of JVX7300RF-W for the development and control for advanced WLP and other thin-films" stated Asaf Shlomo, Jordan Valley's Product Marketing Manager. "This engagement from a leading equipment manufacturer is further acknowledgement of the high value of the JVX7300RF-W tool to provide advanced WLP and plating process metrology solutions," added Shlomo.
Isaac Mazor, Jordan Valley CEO, noted, "We are proud of this win, to be part of center of excellence of another leading supplier, where we will demo our tool as part of advanced tool set for our mutual customers."