With Variable Shaped Beam technology and full writing capabilities on mask or wafer substrates of up to 300 mm in size, the Vistec SB3050-2 is our most advanced electron beam lithography system currently available. This high degree of flexibility opens up a variety of possibilities for research and development, prototyping, and small-scale manufacturing.
Innovative Technology
Effective writing techniques and Variable Shaped Beam electron optics make the simultaneous use of fast exposure and high resolution possible. The Cell Projection function improves throughput and pattern fidelity of repetitive or curvilinear structures.
Thanks to the production-compatible Graphical User Interface (GUI), the Vistec SB3050-2 can be easily integrated into automated production environments (CIM). Capable of exposing both masks (including templates) and wafers, the SB3050-2 exposure tools are ideal for bridging the gap between next-generation technology nodes.
Automation
A high-precision stage system, a sophisticated electron-optical 50 keV column, and state-of-the-art fully automated substrate handling, adjustment, and alignment are all included in the Vistec SB3050-2. This combination ensures excellent resolution performance.
Main Features
- Substrate sizes
- Wafers up to 300 mm/masks up to 9 inches
- Electron-optics
- Variable Shaped Beam/50 kV/cell projection (option)
- Substrate handling
- SMIF/FOUP for fully automated handling
- Writing strategy
- Exposure with continuosly moving stage, vector scan, and multiple pass exposures
- Data preparation
- Optimized exposure results using our specialized ePLACE software, including fracturing, process correction, simulation, and visualization
- Clean room footprint
- < 30 m2 (SB3050-2 including service area)
Image Credit: Vistec Electron Beam
Image Credit: Vistec Electron Beam