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NanoDynamics Showcases Selection of Metal Flakes and Powders at SEMICON West 2008

NanoDynamics will display its selection of metal flakes and powders at SEMICON West 2008, July 15-17 in San Francisco. Providing a large surface area at a small size, these metal powders and flakes are capable of address...

17 Jul 2008

New Service Provides Lower Cost-of-Ownership for Manufacturers Utilizing Xenon

Air Products today introduced its new XeCoverysm on-site xenon recovery service for the semiconductor and MEMS industries. Semiconductor manufacturers faced with rising prices for xenon can now recover and reuse the crucial gas, saving valuable time and money in the process.

17 Jul 2008

In Situ Measurement of Film Thickness and Composition Now Possible with ThinFilmID

Oxford Instruments NanoAnalysis introduces ThinFilmID for the in-situ measurement of composition and thickness of thin films down to 1nm in the SEM. ThinFilmID uses Energy Dispersive X-ray Spectrometry (EDS) to measu...

17 Jul 2008

nGimat Awarded SBIR to Develop Electrode Nanomaterials for Lithium-Ion Batteries

The US Department of Energy (DOE) has awarded nGimat a Small Business Innovation Research (SBIR) Phase I to develop electrode nanomaterials for high-performance Lithium-ion batteries that will be used to power the next g...

16 Jul 2008

Findings Demonstrate Superior Efficacy of Nanoparticle-Based MR Diagnostic Technology

T2 Biosystems, Inc., a company developing the first portable medical diagnostic products which combine nanotechnology and miniaturized magnetic resonance (MR) technology, today announced significant research findings tha...

16 Jul 2008

New Investments Accelerate NY State's International Leadership in Nanotechnology Reasearch and Development

Governor David A. Paterson today announced significant new investments by IBM and New York State, accelerating New York State's international leadership in nanotechnology research and development and creating up to 1...

16 Jul 2008

Providing High Reliability Microelectronic Packaging and Manufacturing Solutions

Neah Power Systems, Inc., a leading developer of fuel cells for military, industrial and consumer portable electronic devices, announced today that it has an ongoing strategic relationship with Aspen Technologies to utilize their high-reliability semiconductor packaging expertise in commercializing its silicon based fuel cell systems. Aspen Technologies is a world-class advanced-packaging service provider enabling its customers to rapidly bring new products to market through the creative application of advanced microelectronic package and assembly technologies, innovative engineering, and scalable manufacturing solutions.

16 Jul 2008

Phantoms Foundation to Coordinate Nanoscale ICT Devices and Systems Coordination Action

The Phantoms Foundation (Spain) has been chosen to coordinate the "Nanoscale ICT Devices and Systems Coordination Action" funded under the Seventh EU Framework Programme. This project aims to reinforce and s...

16 Jul 2008

Collaboration Lowers Development Time and Cost Through Accurate Process Modeling

Mattson Technology, Inc., a leading supplier of advanced semiconductor process equipment used to manufacture integrated circuits (ICs), and Synopsys, Inc., a world leader in software and IP for semiconductor design and m...

16 Jul 2008

Producing Hydrogen Using Water, Solar Energy and Nanotube Diodes

A greener, less expensive method to produce hydrogen for fuel may eventually be possible with the help of water, solar energy and nanotube diodes that use the entire spectrum of the sun's energy, according to Penn St...

16 Jul 2008

Bright Idea Uses Big Science in Nano-Small Packages

The latest bright idea in energy-efficient lighting for homes and offices uses big science in nano-small packages to dim the future Edison's light bulb.

16 Jul 2008

Versatile Platform Offers Multiple Metrology Capabilities in a Single Tool

Nanometrics Incorporated, a leading supplier of advanced process control metrology equipment, today announced the launch of its new Lynx(TM) metrology platform at SEMICON West 2008. The Lynx is the industry's fir...

16 Jul 2008

FEI Connectivity Solutions Reduce Wafers-to-Atoms Time From Days to Hours

FEI Company, a leading provider of atomic-scale imaging and analysis systems, today announced the Ultimate Throughput™ and Ultimate Imaging™ Connectivity Solutions. By accelerating and improving the quality o...

15 Jul 2008

eHARP system Extending Proven Gap-Fill Technology for Critical STI Device Structures to 32nm and Beyond

The eHARP process delivers void-free films to fill <30nm, >12:1 aspect ratio features - essential requirements for the fabrication of advanced memory and logic devices. Featuring proprietary new process innovations, the eHARP system's robust, high-density, strain-inducing films enable the scaling of conventional planar and emerging 3-D device structures.

15 Jul 2008

Depositing Critical Barrier Films for Copper Interconnects in Sub-55nm Memory Chips

Applied Materials, Inc. today announced its Applied Endura® Extensa(TM) PVD1, the industry's only production-worthy system for depositing the critical barrier films for copper interconnects in sub-55nm memory chips.

15 Jul 2008

Nanotechnology News

NanoDynamics Showcases Selection of Metal Flakes and Powders at SEMICON West 2008

New Service Provides Lower Cost-of-Ownership for Manufacturers Utilizing Xenon

In Situ Measurement of Film Thickness and Composition Now Possible with ThinFilmID

nGimat Awarded SBIR to Develop Electrode Nanomaterials for Lithium-Ion Batteries

Findings Demonstrate Superior Efficacy of Nanoparticle-Based MR Diagnostic Technology

New Investments Accelerate NY State's International Leadership in Nanotechnology Reasearch and Development

Providing High Reliability Microelectronic Packaging and Manufacturing Solutions

Phantoms Foundation to Coordinate Nanoscale ICT Devices and Systems Coordination Action

Collaboration Lowers Development Time and Cost Through Accurate Process Modeling

Producing Hydrogen Using Water, Solar Energy and Nanotube Diodes

Bright Idea Uses Big Science in Nano-Small Packages

Versatile Platform Offers Multiple Metrology Capabilities in a Single Tool

FEI Connectivity Solutions Reduce Wafers-to-Atoms Time From Days to Hours

eHARP system Extending Proven Gap-Fill Technology for Critical STI Device Structures to 32nm and Beyond

Depositing Critical Barrier Films for Copper Interconnects in Sub-55nm Memory Chips

News Categories

Electron-Phonon Interactions Boost 2D Semiconductor Conductivity

New Nanomaterial Offers Sustainable Drinking Water Solution

Scalable ZnO/Zn(OH)2 Nanosheets for Stable Lithium Anodes

Carbon Nanofibers Boost Strength and Durability of Fiber Composites

Researchers Use Novel PEG Treatment to Prevent Hydrogel Collapse

Enhancing Slurry Stability in Lithium-Ion Batteries with Turbiscan Technology

PiFM and its Role in Nanoscale Chemical Imaging

Conversations on AFM: How AI is Automating Scanning Probe Microscopy

Sponsored Content

Atomic Force Microscopy Analysis of Polymer Stiffness Under Thermal Stress

Different DLS-Based Systems Can Give Us Different Size Results, and All of Them Can Be correct!

Next Generation Magnetic Force Microscopy with PeakForce Probes

Unlocking Material Behavior at the Microscale Using Nanoindentation