Nanofabrication News

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Nanofabrication Facility at University of Alberta Expanded with ZEISS Electron and Helium Systems

ZEISS announces that it assisted University of Alberta enhance its open access micro and nano scale fabrication facility (nanoFAB) by providing ZEISS helium and electron systems.

From Carl Zeiss Microscopy GmbH 19 Mar 2015

Supercomputing 2014 Conference: Brookhaven Presents Project on Nanostructure Complex Materials Modeling

As the precision, energy, and output of scientific instruments such as particle colliders, light sources, and microscopes increases, so does the volume and complexity of data generated.

19 Mar 2015

Cadence and Intel Partner to Deliver 14nm Library Characterization Reference Flow

Cadence Design Systems Inc. and Intel Corporation today announced that the two companies have delivered a 14nm (nanometer) library characterization reference flow for customers of Intel Custom Foundry, continuing their collaboration on enabling digital and custom/analog flows for the Intel 14nm platform.

From Cadence Design Systems 18 Mar 2015

CWI Technical Sales to Represent Strasbaugh’s CMP and Wafer Grinding Products in the US

Strasbaugh is pleased to announce that on March 3, 2015, an agreement was signed with CWI Technical Sales, making them an official representative of Strasbaugh’s CMP and wafer grinding products in the United States.

13 Mar 2015

Cadence Innovus Implementation System Helps Spreadtrum Reduce Turnaround Time of Multi-Million-Cell 28nm IP Block

Cadence Design Systems, Inc. today announced that Spreadtrum Communications (Shanghai) Co., Ltd. utilized the new Cadence® Innovus™ Implementation System to dramatically reduce the turnaround time of a multi-million-cell 28-nanometer (nm) intellectual property (IP) block while delivering to its power, performance, and area (PPA) goals. Spreadtrum’s TAT for this IP block was reduced significantly while meeting the original PPA targets compared to its previous solution.

From Cadence Design Systems 13 Mar 2015

DATE 2015: CEA-Leti to Present Newest Version of Leti-UTSOI2 for UTBB-FDSOI Technology

CEA-Leti today announced the newest version of its advanced compact model for UTBB-FDSOI technology is now available in all major SPICE simulators.

From CEA-Leti 12 Mar 2015

Innovative Fabrication Technique for Hybrid Nanostructure Supercapacitor Electrode

As a novel energy storage device, supercapacitors have attracted substantial attention in recent years due to their ultra-high charge and discharge rate, excellent stability, long cycle life and very high power density. Imagine charging your cell phone in just a few seconds or fueling up an electric car in but a few minutes, which are both part of the promising future that supercapacitors could offer.

12 Mar 2015

Juniper Networks Improves TAT for 28nm IP Implementation for Networking Applications with Cadence Innovus

Cadence Design Systems, Inc. today announced that Juniper Networks has utilized Cadence® Innovus™ Implementation System to improve turnaround time (TAT) for physical implementation of their most complex 28-nanometer (nm) intellectual property (IP) for networking applications. The networking company was able to achieve throughput of more than 1.8 million cells per day while also improving out-of-the-box design performance by 15 percent.

From Cadence Design Systems 12 Mar 2015

Uniquify Selected by Nufront as DDR IP Provider for 28nm SoC Project

Uniquify, a leading high-performance semiconductor intellectual property (IP) and system-on-chip (SoC) integration and manufacturing services supplier, today announced an agreement with Nufront of Beijing, China, to provide a high-performance DDR subsystem IP solution that supports DDR4, DDR3, LPDDR3 and LPDDR2 protocols.

12 Mar 2015

Major OSAT Manufacturer Selects Rudolph JetStep® Advanced Packaging Lithography System for Evaluation

Rudolph Technologies, Inc. announced today that a major outsourced assembly and test (OSAT) manufacturer has selected the JetStep® Advanced Packaging Lithography System for evaluation. The tool, which ships this week, will be used to develop copper (Cu) pillar bumping and through silicon via (TSV) processes used in the development of next-generation flip chip technology.

From Onto Innovation 12 Mar 2015

Nanofabrication News

Nanofabrication Facility at University of Alberta Expanded with ZEISS Electron and Helium Systems

Supercomputing 2014 Conference: Brookhaven Presents Project on Nanostructure Complex Materials Modeling

Cadence and Intel Partner to Deliver 14nm Library Characterization Reference Flow

CWI Technical Sales to Represent Strasbaugh’s CMP and Wafer Grinding Products in the US

Cadence Innovus Implementation System Helps Spreadtrum Reduce Turnaround Time of Multi-Million-Cell 28nm IP Block

DATE 2015: CEA-Leti to Present Newest Version of Leti-UTSOI2 for UTBB-FDSOI Technology

Innovative Fabrication Technique for Hybrid Nanostructure Supercapacitor Electrode

Juniper Networks Improves TAT for 28nm IP Implementation for Networking Applications with Cadence Innovus

Uniquify Selected by Nufront as DDR IP Provider for 28nm SoC Project

Major OSAT Manufacturer Selects Rudolph JetStep® Advanced Packaging Lithography System for Evaluation

New Nanomaterial Offers Sustainable Drinking Water Solution

New Flexible Material Senses Temperature Without External Power

Carbon Nanofibers Boost Strength and Durability of Fiber Composites

Nano-Formulations Boost Plant Growth and Inhibit Nematode Production

Rapid Biomimetic Nanovaccine for Personalized Cancer Therapy

Enhancing Slurry Stability in Lithium-Ion Batteries with Turbiscan Technology

PiFM and its Role in Nanoscale Chemical Imaging

Conversations on AFM: How AI is Automating Scanning Probe Microscopy

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