A team of researchers has synthesized a highly active and durable class of electrocatalysts by exploiting the structural evolution of solid Pt-Ni bimetallic nanocrystals into porous cage-like structures or nanoframes. This novel material significantly enhanced catalytic activity for the oxygen reduction reaction -- the splitting of an O2 molecule into two oxygen ions -- that is critical to fuel cells and potentially other electrochemical applications.
Matt Maschmann, a researcher at the University of Missouri (MU), has developed a method to predict the way in which carbon nanotubes (CNTs) are formed.
Seong Jin Koh, an associate professor in the Materials Science & Engineering Department at the University of Texas at Arlington, has been awarded a $300,000 grant by the National Science Foundation to build nanoscale pillars that may lead to development of more energy-efficient transistors for applications in electronic gadgets and devices.
Materials that self-assemble and self-destruct once their work is done are highly advantageous for a number of applications – as components in temporary data storage systems or for medical devices. For example, such materials could seal blood vessels during surgery and re-open them subsequently.
Tennant Company today announced ec-H2O NanoClean™, the next generation of the successful, sustainable cleaning technology ec-H2O™. This next generation solution offers the same great benefits of the original and now cleans better, cleans more soils, and is effective in more applications. Tennant Company is a world leader in designing, manufacturing and marketing solutions that help create a cleaner, safer, healthier world.
Xilinx, Inc. today announced that its Virtex® UltraScale™ 20nm FPGA is enabling the JDSU ONT 400G Ethernet test platform. This new platform delivers 400G bandwidth and ensures precise analysis on a true packet-to-packet basis to support the needs and complexity of advanced 400G applications.
Synopsys, Inc. today announced the availability of a broad portfolio of DesignWare® PHY IP for TSMC's 16-nanometer (nm) FinFET Plus (16FF+) processes, enabling designers to integrate required functionality in mobile and enterprise system-on-chips (SoCs) with less risk.
PLDA, the industry leader in PCI Express® controller IP solutions has partnered with GUC, the Flexible ASIC Leader™, to create the fully-integrated complete PCIe Gen 4 solution for TSMC’s 16nm FinFET Plus (16FF+) process. The new PCIe Gen 4 IP can be licensed immediately by system-on-a-chip (SoC) and system companies, enabling solutions that satisfy the throughput, latency and power demands of PCIe 4.0 applications.
AIXTRON SE, one of the world’s leading manufacturers of deposition systems for the semiconductor industry, today announced that it has acquired privately held Silicon Valley-based PlasmaSi, Inc. effective April 1, 2015. The purchase price may reach up to $16 million and will be paid in cash.
“The textbook said we should see slow, gradual and random. But what we saw? BOOM! Fast, explosive and organized!” said Michael Tringides, physicist at the U.S. Department of Energy’s Ames Laboratory and a professor of physics and astronomy at Iowa State University.
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