Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, today announced that Applied Micro Circuits Corporation (NASDAQ: AMCC) has selected the Cadence® Encounter® Digital Implementation (EDI) System for its large, complex advanced-node designs. EDI System joins other multiprocessing-capable offerings in the AppliedMicro™ methodology to form a standardized design infrastructure based set of tools.
“The Cadence EDI System has fast and comprehensive floorplanning capabilities, advanced node-ready hierarchical design closure, low power and integrated yield optimization features. We achieved significant area reduction and higher utilizations on our toughest designs, which were unroutable using our previous methodology,” said Amal Bommireddy, vice president of engineering at AppliedMicro. “With our Encounter RTL Compiler global synthesis and Encounter Conformal technology adoption last year, and EDI System this year, we’re achieving greater productivity and faster time to market for our area-critical, high connectivity, advanced digital networking chips. Its innovative floorplan synthesis, multiprocessor enabled placement, partitioning, budgeting and advanced power planning techniques brought faster, easier hierarchical design closure.”
Cadence’s Nanoroute routing enabled AppliedMicro to port its design from a 90-nanometer process technology to 40 nanometers, while addressing advanced techniques such as multi-cut vias and litho-aware routing.
“Last year, AppliedMicro brought us in to evaluate our Encounter RTL Compiler and Conformal technologies, which were ideally suited for their needs,” said David Desharnais, group director of Implementation Product Management at Cadence. “This year, they decided to conduct a reevaluation of their entire design flow, to ensure that they were getting the most efficient and robust digital solution for their complex 40-nanometer designs. The selection of the Cadence EDI System rounds out AppliedMicro’s design methodology, joining the Cadence Virtuoso® custom IC solution and Cadence Allegro® PCB and packaging technology to enable world class design solution for AppliedMicro.”