Rudolph Technologies proclaimed that it has delivered its multiple NSX Macro Defect Inspection Systems, Wafer Scanner 3880 3D Inspection System and Discover Yield Management Software Suite to a major semiconductor manufacturing company for developing sophisticated three-dimensional IC integration using through silicon via (TSV) based processes.
The reasons behind the selection of the systems are their precision, speed and flexibility for a variety of applications. The Wafer Scanner 3880 3D Inspection System offers macro, RDL and bumps defect check during post-fab processes and better yield management for two-dimensional/three-dimensional RDL and bump metrology for both flip and standard chip wafers.
The Wafer Scanner System uses Rudolph Technologies’ patented Laser Triangulation Technology, which makes the system to perform three-dimensional inspection of various sizes of RDL and bumps at a high speed. The system’s optional feature, ultra-high resolution sensor allows inspection of micro RDL and bumps with heights down to 1µ.
The new NSX 320 System provides inspection solutions for the TSV-based processes to link numerous die in one package, while offering services to critical metrology and inspection solutions to sawn wafers on film frames, wafer-to-wafer arrangement in thinning/back-grinding/bonding processes, X and Z direction edge trimming metrology, die to wafer alignment and via dimensions.
Rudolph Technologies’ inline defect study and data management solution, Discover Yield Management Software is developed to manage sophisticated macro edge, frontside and backside inspection outcomes. The suite’s integrated wafer level ADC allows the software to quickly detect destructive killer defects that can damage the whole wafer. The failure of the device can now be allied to edge and backside defects in one intuitive screen. The excursion detection functionality of the software can automatically trigger alarms and user-defined macros that replicate expert decision-making steps. The company’s Harmony ASR Software helps its yield management portfolio by offering quick, all-surface inspection and categorization to augment inspection and categorization yields.